{
  "abstract": "The increasing structural complexity of BEOL interconnect stacks in advanced integrated circuits demands a structure-aware thermal conductivity (\\k{appa}) modeling framework. However, generalizable models derived from layer-resolved thermal measurements that quantitatively capture the dependence of \\k{appa} on interconnect structures remain lacking, limiting predictive thermal analysis. Here, we establish an experimentally derived, structure-aware \\k{appa} modeling framework enabled by time-domain thermoreflectance measurements with ~100 nm depth resolution. Statistical analysis of a compiled dataset comprising over 40 experimentally measured layer-resolved \\k{appa} values across diverse BEOL layers reveals a generalizable empirical structure-to-\\k{appa} relationship, enabling predictive modeling based on interconnect structure. An intra-layer three-dimensional \\k{appa} distribution model based on effective medium theory and realistic layouts further resolves spatial \\k{appa} variations within practical interconnect layers. Together, these models establish an experimentally derived, structure-aware \\k{appa} modeling framework for predictive and generalizable thermal analysis of advanced interconnect stacks and 3D ICs.",
  "abstract_shown": true,
  "affiliations": [],
  "article_type": null,
  "arxiv": "2609.20379",
  "author_total": 5,
  "authors": [
    {
      "name": "Zifeng Huang"
    },
    {
      "name": "Yiyang Sun"
    },
    {
      "name": "Tianyu Jia"
    },
    {
      "name": "Runsheng Wang"
    },
    {
      "name": "Zhe Cheng"
    }
  ],
  "bibtex": "https://research.draconitic.com/paper/2th38259mhts4.bib",
  "cited_by": 0,
  "doi": "10.48550/arxiv.2609.20379",
  "fulltext_url": null,
  "id": "2th38259mhts4",
  "issns": [],
  "landing_url": "https://arxiv.org/abs/2609.20379",
  "language": null,
  "licence": "LicenseRef-arXiv-nonexclusive-1.0",
  "licence_label": "arXiv licence",
  "licence_source": "article",
  "licence_url": "http://arxiv.org/licenses/nonexclusive-distrib/1.0/",
  "metadata_licence": "CC0-1.0",
  "native_subjects": [
    [
      "arxiv",
      "cond-mat.mes-hall"
    ],
    [
      "arxiv",
      "cond-mat.mtrl-sci"
    ],
    [
      "openalex",
      "2505|Thermal properties of materials"
    ]
  ],
  "openalex": "W7213588958",
  "pdf_url": "https://arxiv.org/pdf/2609.20379",
  "pmcid": null,
  "pmid": null,
  "published": "2026-09-17",
  "publisher": null,
  "ris": "https://research.draconitic.com/paper/2th38259mhts4.ris",
  "sources": [
    {
      "first_seen": "2026-10-30T12:22:19Z",
      "native_id": "2609.20379",
      "source": "arxiv",
      "url": "https://arxiv.org/abs/2609.20379"
    }
  ],
  "subjects": [
    {
      "field": "physics",
      "origin": "arxiv:cond-mat.mes-hall",
      "subfield": "condensed-matter"
    }
  ],
  "title": "Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements",
  "title_text": "Predictive Structure to Thermal Conductivity Modeling Framework for BEOL Interconnect Stacks in Advanced Technology Nodes Enabled by Extensive Layer Resolved Thermal Measurements",
  "type": "preprint",
  "updated_at": "2026-10-30T12:22:19Z",
  "url": "https://research.draconitic.com/paper/2th38259mhts4",
  "venue": "arXiv",
  "versions": []
}