{
  "abstract": "Flexible electronics require thermal-management materials that combine heat dissipation with mechanical compliance, yet flexible polymers are limited by low thermal conductivity. Here, we report a sponge-inspired composite of copper foam (CF), cubic boron nitride (c-BN), and polydimethylsiloxane (PDMS), in which the interconnected CF skeleton and dispersed c-BN fillers create continuous multiscale heat-conduction pathways. This architecture raises in-plane and through-plane thermal conductivities to 21.47 and 3.45 W·m −1 ·K −1 , 141- and 22-fold higher than pure PDMS, respectively. The composite remains flexible, shows a 2569.8% increase in elastic modulus, retains thermal conductivity after 10 6 bending cycles, and provides 25.25 dB EMI shielding and UL-94 V-0 flame retardancy. Integrated into flexible microfluidic heat sinks, it enables stable cooling from 0° to 120° bending, with temperature variations below 4.2% under static bending and 3% during dynamic bending. These results provide a multifunctional thermal-management platform for next-generation flexible electronics.",
  "abstract_shown": true,
  "affiliations": [
    "School of Nuclear Science, Energy and Power Engineering, Shandong University, Jinan 250061, China; Corresponding author",
    "Institute of Thermal Science and Technology, Shandong University, Jinan 250061, China",
    "School of Nuclear Science, Energy and Power Engineering, Shandong University, Jinan 250061, China",
    "Institute of Thermal Science and Technology, Shandong University, Jinan 250061, China; Corresponding author"
  ],
  "article_type": null,
  "arxiv": null,
  "author_total": 7,
  "authors": [
    {
      "affs": [
        0
      ],
      "name": "Bo Liu"
    },
    {
      "affs": [
        1
      ],
      "name": "Encong Hu"
    },
    {
      "affs": [
        2
      ],
      "name": "Minyi Wang"
    },
    {
      "affs": [
        2
      ],
      "name": "Jiaqian Li"
    },
    {
      "affs": [
        1
      ],
      "name": "Ziman Wang"
    },
    {
      "affs": [
        2
      ],
      "name": "Gongming Xin"
    },
    {
      "affs": [
        3
      ],
      "name": "Xinyu Wang"
    }
  ],
  "bibtex": "https://research.draconitic.com/paper/6xrwvj02j6cby.bib",
  "cited_by": 0,
  "doi": "10.1016/j.xcrp.2026.103553",
  "fulltext_url": "http://www.sciencedirect.com/science/article/pii/S2666386426004595",
  "id": "6xrwvj02j6cby",
  "issns": [
    "2666-3864"
  ],
  "landing_url": "https://doi.org/10.1016/j.xcrp.2026.103553",
  "language": "en",
  "licence": "CC-BY",
  "licence_label": "CC BY",
  "licence_source": "journal",
  "licence_url": "https://creativecommons.org/licenses/by/4.0/",
  "metadata_licence": null,
  "native_subjects": [
    [
      "lcc",
      "QC1-999"
    ],
    [
      "openalex",
      "2210|Heat Transfer and Optimization"
    ]
  ],
  "openalex": "W7213601840",
  "pdf_url": null,
  "pmcid": null,
  "pmid": null,
  "published": "2026-10-23",
  "publisher": "Elsevier",
  "ris": "https://research.draconitic.com/paper/6xrwvj02j6cby.ris",
  "sources": [
    {
      "first_seen": "2026-10-30T13:43:36Z",
      "native_id": "b3e2b5afcdf14fe3bcccc274062dcd0c",
      "source": "doaj",
      "url": "https://doi.org/10.1016/j.xcrp.2026.103553"
    }
  ],
  "subjects": [
    {
      "field": "physics",
      "origin": "lcc:QC1-999",
      "subfield": "general"
    }
  ],
  "title": "Enhanced microfluidic heat sinks with a bio-inspired metal skeleton toward thermal management of flexible electronics",
  "title_text": "Enhanced microfluidic heat sinks with a bio-inspired metal skeleton toward thermal management of flexible electronics",
  "type": "peer-reviewed",
  "updated_at": "2026-10-30T13:43:36Z",
  "url": "https://research.draconitic.com/paper/6xrwvj02j6cby",
  "venue": "Cell Reports Physical Science",
  "versions": []
}