{
  "abstract": "Interface design and optimization is critical to enhance the interfacial bonding and thermal properties of the diamond/Cu composites. Herein, Cr and CuCr30 dual coatings with the different thickness on diamond particles were deposited by magnetron sputtering. The Cr element on diamond particles transformed to Cr 3 C 2 during sintering, with coexisting interfacial phases of Cr 3 C 2 and Cu to strengthen the interface bonding. Relatively thicker interlayers (∼200 nm and ∼270 nm) act as an effective bridge between diamond and Cu, improving wettability and reducing thermal stress, where no obvious debonding was found and the compact diamond/Cu composites were achieved. The results suggest that the interface structure evolution plays a critical role in determining the thermal conductivity, CTE and thermal cycling behavior of diamond/Cu composites. By measuring the thermal conductivity before and after thermal cycling, we found that the composites with an intermediate thickness of the interlayer possessed the maximum thermal conductivity (686 W/mK), while that with a thicker interlayer presented a better comprehensive performance with a relatively high initial thermal conductivity (646 W/mK), compatible CTE (7.49×10 -6 /K from room temperature to 200 °C) and stable thermal cycling performance (4% attenuation of thermal conductivity for 300 cycles from -50 °C to 150 °C). This work demonstrates that a trade-off exists between maximizing initial thermal conductivity and ensuring long-term thermal stability for diamond/Cu composites.",
  "abstract_shown": true,
  "affiliations": [
    "College of Materials Science and Engineering, Changsha University of Science & Technology, Changsha 410014, PR China",
    "State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, PR China",
    "Hunan Xinjuneng Technology Co., Ltd, Changsha 410083, PR China"
  ],
  "article_type": null,
  "arxiv": null,
  "author_total": 12,
  "authors": [
    {
      "affs": [
        0
      ],
      "name": "Wentao Hu"
    },
    {
      "affs": [
        1
      ],
      "name": "Zengkai Jiao"
    },
    {
      "affs": [
        2
      ],
      "name": "Kaitang Huang"
    },
    {
      "affs": [
        0,
        1
      ],
      "name": "Long Zhang",
      "orcid": "0009-0005-2979-6545"
    },
    {
      "affs": [
        0
      ],
      "name": "Changyu Yin"
    },
    {
      "affs": [
        0
      ],
      "name": "Yangfan Liao"
    },
    {
      "affs": [
        0
      ],
      "name": "Hongtao Yu"
    },
    {
      "affs": [
        0
      ],
      "name": "Haiyun Yang"
    },
    {
      "affs": [
        0
      ],
      "name": "Yonggang Wang"
    },
    {
      "affs": [
        1
      ],
      "name": "Li Ma"
    },
    {
      "affs": [
        1
      ],
      "name": "Qiuping Wei",
      "orcid": "0000-0002-8109-5982"
    },
    {
      "affs": [
        1
      ],
      "name": "Kechao Zhou",
      "orcid": "0000-0003-2984-1404"
    }
  ],
  "bibtex": "https://research.draconitic.com/paper/as9qdqnw5r4fk.bib",
  "cited_by": 5,
  "doi": "10.1016/j.jmrt.2026.06.067",
  "fulltext_url": null,
  "id": "as9qdqnw5r4fk",
  "issns": [
    "2214-0697",
    "2238-7854"
  ],
  "landing_url": "https://doi.org/10.1016/j.jmrt.2026.06.067",
  "language": "en",
  "licence": "CC-BY-NC-ND",
  "licence_label": "CC BY-NC-ND",
  "licence_source": "journal",
  "licence_url": "https://creativecommons.org/licenses/by-nc-nd/4.0/",
  "metadata_licence": null,
  "native_subjects": [
    [
      "openalex",
      "2505|Thermal properties of materials"
    ]
  ],
  "openalex": "W7163914151",
  "pdf_url": null,
  "pmcid": null,
  "pmid": null,
  "published": "2026-06-08",
  "publisher": "Elsevier BV",
  "ris": "https://research.draconitic.com/paper/as9qdqnw5r4fk.ris",
  "sources": [
    {
      "first_seen": "2026-11-06T13:20:45Z",
      "native_id": "W7163914151",
      "source": "openalex",
      "url": "https://doi.org/10.1016/j.jmrt.2026.06.067"
    }
  ],
  "subjects": [
    {
      "field": "chemistry",
      "origin": "openalex:2505|Thermal properties of materials",
      "subfield": "materials-polymers"
    }
  ],
  "title": "The balance of thermal conductivity and stability of diamond/Cu composites through interfacial design of Cr–CuCr dual coatings",
  "title_text": "The balance of thermal conductivity and stability of diamond/Cu composites through interfacial design of Cr–CuCr dual coatings",
  "type": "peer-reviewed",
  "updated_at": "2026-11-06T13:20:45Z",
  "url": "https://research.draconitic.com/paper/as9qdqnw5r4fk",
  "venue": "Journal of Materials Research and Technology",
  "versions": []
}