{
  "abstract": "We demonstrate a novel method for fabricating densely packed, high-aspect-ratio cavities (depth to diameter ratio > 1) in silicon wafers coated with diamond-like carbon (DLC). The process combines femtosecond laser irradiation with subsequent wet etch (potassium hydroxide-based) or plasma etch (chlorine- and oxygen-based). The femtosecond laser is used to pattern precise openings in the DLC layer, exposing the underlying silicon, which is then rapidly etched to form well-defined cavities. This combined laser ablation and etching approach enables high-throughput fabrication of densely packed micrometer cavities and offers scalability toward industrial production. The resulting hybrid DLC-coated silicon structure, featuring densely packed cavities, may exhibit antireflective properties in the far-infrared spectrum range.",
  "abstract_shown": true,
  "affiliations": [],
  "article_type": null,
  "arxiv": null,
  "author_total": 16,
  "authors": [
    {
      "name": "Xxx Sedao"
    },
    {
      "name": "Javier Prada-Rodrigo"
    },
    {
      "name": "Agathe Cavanna"
    },
    {
      "name": "Ionut-Alexandru Bunea"
    },
    {
      "name": "Antoine Gonon"
    },
    {
      "name": "William Ravisy"
    },
    {
      "name": "Yannick Bleu"
    },
    {
      "name": "Christian Seassal"
    },
    {
      "name": "Yves Jourlin"
    },
    {
      "name": "Laurent Dubost"
    },
    {
      "name": "Nicolas Crespo-Monteiro"
    },
    {
      "name": "Razvan Stoian"
    },
    {
      "name": "Yoan Di Maio"
    },
    {
      "name": "Claire Deeb"
    },
    {
      "name": "Isabelle Verrier"
    },
    {
      "name": "Emilie Gamet"
    }
  ],
  "bibtex": "https://research.draconitic.com/paper/bwfnze0pevv5c.bib",
  "cited_by": 0,
  "doi": "10.3390/nano16181131",
  "fulltext_url": null,
  "id": "bwfnze0pevv5c",
  "issns": [
    "2079-4991",
    "2079-4991"
  ],
  "landing_url": "https://hal.science/hal-05745514v1",
  "language": "en",
  "licence": "CC-BY-4.0",
  "licence_label": "CC BY 4.0",
  "licence_source": "article",
  "licence_url": "https://creativecommons.org/licenses/by/4.0/",
  "metadata_licence": null,
  "native_subjects": [
    [
      "hal",
      "0.chim"
    ],
    [
      "hal",
      "0.nlin"
    ],
    [
      "hal",
      "0.phys"
    ],
    [
      "openalex",
      "2206|Laser Material Processing Techniques"
    ]
  ],
  "openalex": "W7212144321",
  "pdf_url": "https://hal.science/hal-05745514/document",
  "pmcid": null,
  "pmid": null,
  "published": "2026-09-10",
  "publisher": "MDPI",
  "ris": "https://research.draconitic.com/paper/bwfnze0pevv5c.ris",
  "sources": [
    {
      "first_seen": "2026-10-30T12:17:55Z",
      "native_id": "hal-05745514",
      "source": "hal",
      "url": "https://hal.science/hal-05745514v1"
    }
  ],
  "subjects": [
    {
      "field": "chemistry",
      "origin": "hal:0.chim",
      "subfield": "general"
    },
    {
      "field": "physics",
      "origin": "hal:0.nlin",
      "subfield": "statistical-nonlinear"
    }
  ],
  "title": "Hybrid Laser–Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing",
  "title_text": "Hybrid Laser–Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing",
  "type": "peer-reviewed",
  "updated_at": "2026-10-30T12:17:55Z",
  "url": "https://research.draconitic.com/paper/bwfnze0pevv5c",
  "venue": "Nanomaterials",
  "versions": []
}