{
  "abstract": "Adhesives are commonly designed either as reworkable thermoplastics or permanently crosslinked thermosets. Here, sequential thermoplastic-to-thermoset curing enables a simple two-component formulation based on a bio-based epoxy resin to function first as a removable hot-melt adhesive and subsequently as a permanent structural adhesive. Reaction of diglycidyl ether of vanillyl alcohol (DGEVA) and anilinium methanesulfonate at 110 °C produces a thermoplastic intermediate that is solid at room temperature but flows upon reheating and dissolves in selected solvents. This intermediate forms load-bearing joints that can be thermally debonded and rebonded or disassembled by dissolution. Further heating induces crosslinking and converts the same adhesive layer into a permanent epoxy network, increasing the apparent lap-shear strength nearly eightfold and rendering the joint resistant to disassembly under the same solvent conditions. This curing sequence therefore assigns reworkability and high-strength permanent bonding to successive adhesive states within the same formulation.",
  "abstract_shown": true,
  "affiliations": [],
  "article_type": null,
  "arxiv": null,
  "author_total": 10,
  "authors": [
    {
      "name": "Izabela Kurowska"
    },
    {
      "name": "Kaan Yorganci"
    },
    {
      "name": "Nora Aranburu"
    },
    {
      "name": "Itxaso Calafel"
    },
    {
      "name": "Amaia Agirre"
    },
    {
      "name": "Leire Unanue"
    },
    {
      "name": "Itziar Otaegi"
    },
    {
      "name": "Nerea Casado"
    },
    {
      "name": "Ibon Odriozola",
      "orcid": "0000-0003-4243-6294"
    },
    {
      "name": "David Mecerreyes"
    }
  ],
  "bibtex": "https://research.draconitic.com/paper/dh837by3tsxas.bib",
  "cited_by": 0,
  "doi": "10.26434/chemrxiv.15009986/v1",
  "fulltext_url": null,
  "id": "dh837by3tsxas",
  "issns": [],
  "landing_url": "https://chemrxiv.org/doi/full/10.26434/chemrxiv.15009986/v1",
  "language": null,
  "licence": "CC-BY-NC-ND",
  "licence_label": "CC BY-NC-ND",
  "licence_source": "journal",
  "licence_url": "https://creativecommons.org/licenses/by-nc-nd/4.0/",
  "metadata_licence": null,
  "native_subjects": [
    [
      "openalex",
      "2210|Epoxy Resin Curing Processes"
    ]
  ],
  "openalex": "W7220748069",
  "pdf_url": "https://chemrxiv.org/doi/pdf/10.26434/chemrxiv.15009986/v1",
  "pmcid": null,
  "pmid": null,
  "published": "2026-10-06",
  "publisher": "American Chemical Society (ACS)",
  "ris": "https://research.draconitic.com/paper/dh837by3tsxas.ris",
  "sources": [
    {
      "first_seen": "2026-10-30T12:17:22Z",
      "native_id": "10.26434/chemrxiv.15009986",
      "source": "chemrxiv",
      "url": "https://chemrxiv.org/doi/full/10.26434/chemrxiv.15009986/v1"
    }
  ],
  "subjects": [
    {
      "field": "chemistry",
      "origin": "source:chemrxiv",
      "subfield": "general"
    }
  ],
  "title": "A Biobased Epoxy Resin with Sequential Thermoplastic-to-Thermoset Curing Enables Removable-to-Permanent Adhesive Bonding",
  "title_text": "A Biobased Epoxy Resin with Sequential Thermoplastic-to-Thermoset Curing Enables Removable-to-Permanent Adhesive Bonding",
  "type": "preprint",
  "updated_at": "2026-10-30T12:17:22Z",
  "url": "https://research.draconitic.com/paper/dh837by3tsxas",
  "venue": "ChemRxiv",
  "versions": []
}