{
  "abstract": "Cryogenic computing technologies are maturing rapidly, but heat removal remains a key challenge when increasing the device density and operating power. Two-phase evaporative cooling is a promising approach to solve this issue, because it can dissipate high heat fluxes while maintaining small temperature rises. Here, we numerically investigate liquid-$\\mathrm{N_2}$-filled silicon micropillar wicks as a capillary-fed thin-film evaporation concept for cryogenic electronics. The model combines Young-Laplace meniscus calculations, Hertz-Knudsen-Schrage evaporation, unit-cell heat-transfer and liquid-flow simulations, and an array-level thermal and capillary-flow model. For a representative geometry with a pillar diameter of $10\\,μ\\mathrm{m}$, pitch of $24\\,μ\\mathrm{m}$, and pillar height of $75\\,μ\\mathrm{m}$ at an applied heat flux of $20\\,\\mathrm{W\\,cm^{-2}}$, the predicted chip-temperature rise is approximately $2.7\\,\\mathrm{K}$. This is substantially below the estimated temperature rises for representative conduction cooling through an indium-interlayered copper heat sink and direct liquid-$\\mathrm{N_2}$ immersion. The corresponding predicted single-fed dry-out length is approximately $2.7\\,\\mathrm{mm}$, equivalent to an ideal double-fed coolable width of approximately $5.3\\,\\mathrm{mm}$. The results indicate that local thermal performance is favorable, whereas lateral scalability is primarily constrained by capillary dry-out. An approximate capillary-viscous scaling relation provides a compact framework for comparing dry-out limits across working fluids and related wick geometries and for identifying strategies to extend capillary-fed transport.",
  "abstract_shown": true,
  "affiliations": [],
  "article_type": null,
  "arxiv": "2609.21639",
  "author_total": 5,
  "authors": [
    {
      "name": "Felix Mende"
    },
    {
      "name": "Marcus Wislicenus"
    },
    {
      "name": "Dianping Jiang"
    },
    {
      "name": "Munehiro Tada"
    },
    {
      "name": "Lukas M. Eng"
    }
  ],
  "bibtex": "https://research.draconitic.com/paper/dwj6j8hdzsb2d.bib",
  "cited_by": 0,
  "doi": "10.48550/arxiv.2609.21639",
  "fulltext_url": null,
  "id": "dwj6j8hdzsb2d",
  "issns": [],
  "landing_url": "https://arxiv.org/abs/2609.21639",
  "language": null,
  "licence": "LicenseRef-arXiv-nonexclusive-1.0",
  "licence_label": "arXiv licence",
  "licence_source": "article",
  "licence_url": "http://arxiv.org/licenses/nonexclusive-distrib/1.0/",
  "metadata_licence": "CC0-1.0",
  "native_subjects": [
    [
      "arxiv",
      "physics.app-ph"
    ],
    [
      "arxiv",
      "physics.comp-ph"
    ],
    [
      "arxiv",
      "physics.flu-dyn"
    ],
    [
      "openalex",
      "2210|Heat Transfer and Boiling Studies"
    ]
  ],
  "openalex": "W7213869529",
  "pdf_url": "https://arxiv.org/pdf/2609.21639",
  "pmcid": null,
  "pmid": null,
  "published": "2026-09-18",
  "publisher": null,
  "ris": "https://research.draconitic.com/paper/dwj6j8hdzsb2d.ris",
  "sources": [
    {
      "first_seen": "2026-10-30T12:23:03Z",
      "native_id": "2609.21639",
      "source": "arxiv",
      "url": "https://arxiv.org/abs/2609.21639"
    }
  ],
  "subjects": [
    {
      "field": "physics",
      "origin": "arxiv:physics.app-ph",
      "subfield": "applied-instrumentation"
    },
    {
      "field": "physics",
      "origin": "arxiv:physics.comp-ph",
      "subfield": "computational"
    },
    {
      "field": "physics",
      "origin": "arxiv:physics.flu-dyn",
      "subfield": "fluid-dynamics"
    }
  ],
  "title": "Liquid-Nitrogen Micropillar-Wick Cooling for Cryogenic Electronics: A Numerical Study of Thermal Performance and Capillary Dry-Out Limits",
  "title_text": "Liquid-Nitrogen Micropillar-Wick Cooling for Cryogenic Electronics: A Numerical Study of Thermal Performance and Capillary Dry-Out Limits",
  "type": "preprint",
  "updated_at": "2026-10-30T12:23:03Z",
  "url": "https://research.draconitic.com/paper/dwj6j8hdzsb2d",
  "venue": "arXiv",
  "versions": []
}