{
  "abstract": "In-situ rapid solidification studies demand measurements of thermal histories with high temporal resolution. We present a simple, effective setup to quantify the cooling response of an uncoated commercial Protochips Fusion MEMS chip in an in-situ scanning transmission electron microscopy (STEM) context. We drive user-defined temperature programs via an arbitrary waveform generator (AWG), while recording the voltage drops across a series shunt to reconstruct chip resistance and temperature at sub-millisecond resolution. We confirm the response times inferred from the current; however, the temperature obtained from the physically linked resistance, $T(R)$, evolves more slowly. Analysis of the maximum cooling step reveals an exponential-like relaxation with time constant $τ=1.80$ ms, consistent with reported thermal lag constants for fast scanning calorimetry. From the time to reach $95\\%$ of the temperature difference $ΔT$, we measure an average cooling rate of $\\approx 7.9\\times 10^{4}$ K/s. Robustness checks include repeated $R(T)$ measurements (revealing a modest downward drift approaching an asymptote), a 10 k$Ω$ test load, and characterization of small off-duty arbitrary waveform generator leakage/offsets. These findings define practical bounds on achievable thermal-path rates when planning in-situ electron microscopy experiments with this chip platform.",
  "abstract_shown": true,
  "affiliations": [],
  "article_type": null,
  "arxiv": "2609.08473",
  "author_total": 2,
  "authors": [
    {
      "name": "Phillip Dumitraschkewitz"
    },
    {
      "name": "Thomas Kremmer"
    }
  ],
  "bibtex": "https://research.draconitic.com/paper/e7m37wxedtfxy.bib",
  "cited_by": 0,
  "doi": "10.48550/arxiv.2609.08473",
  "fulltext_url": null,
  "id": "e7m37wxedtfxy",
  "issns": [],
  "landing_url": "https://arxiv.org/abs/2609.08473",
  "language": null,
  "licence": "CC-BY-4.0",
  "licence_label": "CC BY 4.0",
  "licence_source": "article",
  "licence_url": "http://creativecommons.org/licenses/by/4.0/",
  "metadata_licence": "CC0-1.0",
  "native_subjects": [
    [
      "arxiv",
      "cond-mat.mtrl-sci"
    ],
    [
      "openalex",
      "1315|Advanced Electron Microscopy Techniques and Applications"
    ]
  ],
  "openalex": "W7212005729",
  "pdf_url": "https://arxiv.org/pdf/2609.08473",
  "pmcid": null,
  "pmid": null,
  "published": "2026-09-08",
  "publisher": null,
  "ris": "https://research.draconitic.com/paper/e7m37wxedtfxy.ris",
  "sources": [
    {
      "first_seen": "2026-10-30T12:19:52Z",
      "native_id": "2609.08473",
      "source": "arxiv",
      "url": "https://arxiv.org/abs/2609.08473"
    }
  ],
  "subjects": [
    {
      "field": "physics",
      "origin": "arxiv:cond-mat.mtrl-sci",
      "subfield": "condensed-matter"
    }
  ],
  "title": "Thermal response of an in-situ STEM MEMS chip under rapid pulse heating",
  "title_text": "Thermal response of an in-situ STEM MEMS chip under rapid pulse heating",
  "type": "preprint",
  "updated_at": "2026-10-30T12:19:52Z",
  "url": "https://research.draconitic.com/paper/e7m37wxedtfxy",
  "venue": "arXiv",
  "versions": []
}