{
  "abstract": "Advanced electronic packaging structures represent a key technological approach for extending Moore's Law. An electronic packaging structure consists of multiple materials with distinct properties, constituting a composite structure with complex spatial architecture. This paper develops an unfitted cut finite element method (CutFEM) for transient heat conduction simulation in multi-material electronic packaging structures with complex material interfaces. In the proposed computational framework, the heterogeneous spatial geometric features of electronic packaging structures is embedded and characterized in a regular background mesh, thereby avoiding the generation of body-fitted meshes on complicated interfaces. Interface temperature and heat-flux transmission conditions are imposed by a coefficient-weighted symmetric Nitsche formulation. In addition, a ghost-penalty stabilization controls arbitrarily small intersections between the physical materials and background meshes. Furthermore, the semi-discrete and fully-discrete numerical schemes are proposed, and an explicit energy estimate is derived in detail. Finally, two-dimensional and three-dimensional electronic packaging structures containing substrate, molding compound, die, and solder balls are designed to validate its accuracy, efficiency, and scalability in simulating challenging transient thermal problems.",
  "abstract_shown": true,
  "affiliations": [],
  "article_type": null,
  "arxiv": "2610.08543",
  "author_total": 1,
  "authors": [
    {
      "name": "Hao Dong"
    }
  ],
  "bibtex": "https://research.draconitic.com/paper/f1hae0mdxfg5p.bib",
  "cited_by": 0,
  "doi": "10.48550/arxiv.2610.08543",
  "fulltext_url": null,
  "id": "f1hae0mdxfg5p",
  "issns": [],
  "landing_url": "https://arxiv.org/abs/2610.08543",
  "language": null,
  "licence": "LicenseRef-arXiv-nonexclusive-1.0",
  "licence_label": "arXiv licence",
  "licence_source": "article",
  "licence_url": "http://arxiv.org/licenses/nonexclusive-distrib/1.0/",
  "metadata_licence": "CC0-1.0",
  "native_subjects": [
    [
      "arxiv",
      "cs.NA"
    ],
    [
      "arxiv",
      "math.NA"
    ],
    [
      "openalex",
      "2206|Advanced Numerical Methods in Computational Mathematics"
    ]
  ],
  "openalex": "W7220980799",
  "pdf_url": "https://arxiv.org/pdf/2610.08543",
  "pmcid": null,
  "pmid": null,
  "published": "2026-10-06",
  "publisher": null,
  "ris": "https://research.draconitic.com/paper/f1hae0mdxfg5p.ris",
  "sources": [
    {
      "first_seen": "2026-10-30T12:27:26Z",
      "native_id": "2610.08543",
      "source": "arxiv",
      "url": "https://arxiv.org/abs/2610.08543"
    }
  ],
  "subjects": [
    {
      "field": "mathematics",
      "origin": "arxiv:math.NA",
      "subfield": "numerical-analysis"
    }
  ],
  "title": "A Cut Finite Element Method for Transient Thermal Simulation in Multi-material Electronic Packaging Structures",
  "title_text": "A Cut Finite Element Method for Transient Thermal Simulation in Multi-material Electronic Packaging Structures",
  "type": "preprint",
  "updated_at": "2026-10-30T12:27:26Z",
  "url": "https://research.draconitic.com/paper/f1hae0mdxfg5p",
  "venue": "arXiv",
  "versions": []
}