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Peer-reviewedCC BYAdvanced Science

Grain Boundary Structure Ordering via Electroshock Treatment Enhances Strength‐Ductility Synergy

  • Jiancheng Chen1,2,3,4
  • Feng Wang2,3,4
  • Dongsheng Qian2,3,4
  • Huiling Wang2,3,4
  • Jinsong Wu5,6
  • Mingwang Fu1
  • Lin Hua2,3,4
6 affiliations
  1. 1Department of Mechanical Engineering Research Institute for Advanced Manufacturing The Hong Kong Polytechnic University Kowloon Hong Kong China
  2. 2Hubei Engineering Research Center for Green Precision Material Forming Wuhan China
  3. 3School of Materials Science and Engineering Wuhan University of Technology Wuhan China
  4. 4State Key Laboratory of Light Superalloys Wuhan University of Technology Wuhan China
  5. 5State Key Laboratory of Advanced Technology for Materials Synthesis and Processing Wuhan University of Technology Wuhan China
  6. 6Yangtze Laboratory Wuhan China
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Abstract

High-energy electropulsing triggers recrystallization and phase transformation via excessive Joule heating, potentially causing unwanted damage and compromising the bulk microstructure. Herein, a non-destructive, low-energy electric current strategy, termed electroshock treatment (EST), is developed to strengthen grain boundaries (GBs), the preferential site for crack initiation and propagation, while preserving the bulk microstructure. Using α-Ti as a model system, this strategy achieves a synergistic enhancement of strength and ductility by transforming the defect-rich GB structure into an ordered atomic arrangement. In situ micropillar compression tests confirm a significant increase in GB strength after EST, while molecular dynamics (MD) simulations reveal that ordered GBs, owing to their lower density of defects, raise the critical stress for dislocation emission and exhibit greater resistance to intergranular fracture. Additionally, a reduction in dislocation density after EST contributes to enhanced ductility. These findings provide a promising GB-structure-engineering pathway to reinforce polycrystalline metallic materials.

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Cite

BibTeXRIS
BibTeX
@article{chen2026grain,
  title = {{Grain Boundary Structure Ordering via Electroshock Treatment Enhances Strength‐Ductility Synergy}},
  author = {Jiancheng Chen and Feng Wang and Dongsheng Qian and Huiling Wang and Jinsong Wu and Mingwang Fu and Lin Hua},
  journal = {Advanced Science},
  year = {2026},
  month = aug,
  doi = {10.1002/advs.77128},
  url = {https://doi.org/10.1002/advs.77128},
  note = {CC BY},
}
RIS
TY  - JOUR
TI  - Grain Boundary Structure Ordering via Electroshock Treatment Enhances Strength‐Ductility Synergy
AU  - Jiancheng Chen
AU  - Feng Wang
AU  - Dongsheng Qian
AU  - Huiling Wang
AU  - Jinsong Wu
AU  - Mingwang Fu
AU  - Lin Hua
PY  - 2026
DA  - 2026/08/19
JO  - Advanced Science
DO  - 10.1002/advs.77128
UR  - https://doi.org/10.1002/advs.77128
AB  - High-energy electropulsing triggers recrystallization and phase transformation via excessive Joule heating, potentially causing unwanted damage and compromising the bulk microstructure. Herein, a non-destructive, low-energy electric current strategy, termed electroshock treatment (EST), is developed to strengthen grain boundaries (GBs), the preferential site for crack initiation and propagation, while preserving the bulk microstructure. Using α-Ti as a model system, this strategy achieves a synergistic enhancement of strength and ductility by transforming the defect-rich GB structure into an ordered atomic arrangement. In situ micropillar compression tests confirm a significant increase in GB strength after EST, while molecular dynamics (MD) simulations reveal that ordered GBs, owing to their lower density of defects, raise the critical stress for dislocation emission and exhibit greater resistance to intergranular fracture. Additionally, a reduction in dislocation density after EST contributes to enhanced ductility. These findings provide a promising GB-structure-engineering pathway to reinforce polycrystalline metallic materials.
SN  - 2198-3844
ER  -