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Peer-reviewedLicence not statedComposites Part B Engineering

Hierarchical sandwich composite film with engineered interfaces for concurrent high-frequency ultra-low dielectric constant and high thermal conductivity

  • Kun Peng1
  • Xinyan Yang1
  • Yujie You1
  • Jiahong Wei1
  • Shuo Xu1
  • M. D. Zahidul Islam
  • Bin Zheng2
  • Yaqin Fu3,1
  1. 1School of Materials Science and Engineering, Zhejiang Sci-Tech University, Hangzhou, Zhejiang, 310018, China
  2. 2School of Information and Electronic Engineering, Zhejiang University, Hangzhou, Zhejiang, 310027, China
  3. 3Key Laboratory of Advanced Textile Materials and Manufacturing Technology of Ministry of Education, Zhejiang Sci-Tech University, Hangzhou, Zhejiang, 310018, China
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Cite

BibTeXRIS
BibTeX
@article{peng2026hierarchical,
  title = {{Hierarchical sandwich composite film with engineered interfaces for concurrent high-frequency ultra-low dielectric constant and high thermal conductivity}},
  author = {Kun Peng and Xinyan Yang and Yujie You and Jiahong Wei and Shuo Xu and M. D. Zahidul Islam and Bin Zheng and Yaqin Fu},
  journal = {Composites Part B Engineering},
  year = {2026},
  month = may,
  doi = {10.1016/j.compositesb.2026.113801},
  url = {https://doi.org/10.2139/ssrn.6088557},
}
RIS
TY  - JOUR
TI  - Hierarchical sandwich composite film with engineered interfaces for concurrent high-frequency ultra-low dielectric constant and high thermal conductivity
AU  - Kun Peng
AU  - Xinyan Yang
AU  - Yujie You
AU  - Jiahong Wei
AU  - Shuo Xu
AU  - M. D. Zahidul Islam
AU  - Bin Zheng
AU  - Yaqin Fu
PY  - 2026
DA  - 2026/05/14
JO  - Composites Part B Engineering
DO  - 10.1016/j.compositesb.2026.113801
UR  - https://doi.org/10.2139/ssrn.6088557
SN  - 1359-8368
SN  - 1879-1069
ER  -