Synergistically Enhanced Properties of Polyimide Films via In-Situ Hollow SiO2 Nanospheres
- 1School of Physical Science and Technology, Nantong University, Nantong 226019, China
- 2Nantong Bolian Tech Co., Ltd., Nantong 226019, China
Abstract
Polyimide (PI) films serving as high-temperature dielectric and structural materials are increasingly required to combine mechanical robustness, thermal stability, and low dielectric properties for advanced electronic packaging. Herein, PI composite films incorporated with 110 nm hollow SiO2 nanospheres were fabricated via in-situ synthesis and subsequent thermal imidization. The optimal comprehensive performance was achieved at a SiO2 filler loading of 10%. Relative to pristine PI, the optimal composite delivered a 33% enhancement in room-temperature tensile strength (reaching 68 MPa), a 28% increase at 200 °C (reaching 64 MPa), and a 64% improvement at 250 °C (reaching 66 MPa). Benefiting from the hollow filler structure, this sample also exhibited enhanced ductility (reflected by a 1.3% rise in elongation at break), the most favorable thermal stability among all specimens, and a 3.5% reduction in relative dielectric constant, collectively achieving the synergistic enhancement of mechanical, thermal, and dielectric properties and rendering the composite a promising candidate for high-temperature electronic insulation applications.
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BibTeX
@article{wu2026synergistically,
title = {{Synergistically Enhanced Properties of Polyimide Films via In-Situ Hollow SiO2 Nanospheres}},
author = {Zheng Wu and Rui Meng and Chonggui Zhong and Yanyan Huang and Juehong Guo and Yuchi Cheng and Zhongwei Yu},
journal = {Molecules (Basel, Switzerland)},
year = {2026},
month = oct,
doi = {10.3390/molecules31193567},
url = {https://europepmc.org/article/PMC/PMC13666769},
note = {CC BY},
}
RIS
TY - JOUR
TI - Synergistically Enhanced Properties of Polyimide Films via In-Situ Hollow SiO2 Nanospheres
AU - Zheng Wu
AU - Rui Meng
AU - Chonggui Zhong
AU - Yanyan Huang
AU - Juehong Guo
AU - Yuchi Cheng
AU - Zhongwei Yu
PY - 2026
DA - 2026/10/01
JO - Molecules (Basel, Switzerland)
DO - 10.3390/molecules31193567
UR - https://europepmc.org/article/PMC/PMC13666769
AB - Polyimide (PI) films serving as high-temperature dielectric and structural materials are increasingly required to combine mechanical robustness, thermal stability, and low dielectric properties for advanced electronic packaging. Herein, PI composite films incorporated with 110 nm hollow SiO2 nanospheres were fabricated via in-situ synthesis and subsequent thermal imidization. The optimal comprehensive performance was achieved at a SiO2 filler loading of 10%. Relative to pristine PI, the optimal composite delivered a 33% enhancement in room-temperature tensile strength (reaching 68 MPa), a 28% increase at 200 °C (reaching 64 MPa), and a 64% improvement at 250 °C (reaching 66 MPa). Benefiting from the hollow filler structure, this sample also exhibited enhanced ductility (reflected by a 1.3% rise in elongation at break), the most favorable thermal stability among all specimens, and a 3.5% reduction in relative dielectric constant, collectively achieving the synergistic enhancement of mechanical, thermal, and dielectric properties and rendering the composite a promising candidate for high-temperature electronic insulation applications.
SN - 1420-3049
ER -