Skip to content
DraconiticResearch
Search Sources API
194,216 studies31 sourcesUpdated 37 min ago
Peer-reviewedCC BY-NC-ND 4.0ACS Omega

Mechanism and Application of Imidazolium Derivatives as a Bifunctional Additive for Void-free Blind via Copper Filling

  • Haoying Liu1,2
  • Yuli Zhang1,2
  • Yusa Geng1
  • Yuanyuan Xu1,2
  • Dongxue Qin1
  • Xusen Li1,2
  • Cong Gao1,2
  • Shipeng Chen1,3,2
  1. 1Institute of Chemistry Co. Ltd, Henan Academy of Science , , ,
  2. 2Henan Academy of Sciences , ,
  3. 3Henan Academy of Sciences , , ,
Open at sourcePDFDOICite

Abstract

In conventional acidic copper electroplating, the accelerator and leveler are typically provided by different molecules, resulting in complex additive formulations and difficult-to-control intermolecular interactions. This study proposes an “intramolecular functional group division” strategy and designs a series of imidazolium salts bearing different substituents as bifunctional additives, integrating the leveling function of the imidazolium cation and the accelerating function of the pendant groups within a single molecule. Electrochemical measurements, electroplating of silicon-based micro blind vias, and multi-scale characterization demonstrate that a simplified binary system consisting solely of this additive and PEG8000 can achieve void-free superconformal filling. Systematic comparison of four imidazole derivatives containing sulfonate, cyano, and carboxyl substituents establishes a clear structure–activity relationship: the sulfonate group is the key moiety that confers the accelerating effect, Cl– bridging is a prerequisite for strong adsorption, and the structural basis for acceleration is that the sulfonate group remains exposed on the outer surface without participating in copper-surface adsorption. DFT calculations further elucidate this mechanism from the perspectives of electronic structure and adsorption configuration. This work elevates the integration of dual functions in copper electroplating additives from intermolecular synergy to the single-molecule level, providing a new paradigm for the design of multifunctional electroplating additives.

Related

  1. Integrated Biochemical and Computational Evaluation of Bis-Imidazolium Derivatives 3e–3g in Cholinesterase and HIV-1 Reverse Transcriptase Assays
    Edanur Altuntas, Aleyna Nalcaoglu Senocak, Yasemin Ünver +1
    MoleculesPeer-reviewedCC BY 4.0General chemistryCrossref
  2. An orbital-coupling-driven bifunctional prelithiation additive for enhanced practical Li-ion full cells
    Na Tian, Xing Liu, Kangyu Zhou +7
    Chemical SciencePeer-reviewedCC BY-NC 3.0Full textOrganic chemistryPMC
  3. Microwave-Assisted Synthesis, Cytotoxic Profile, and Cellular Mechanism Analysis of Carveoylphenol Derivatives
    Evelyn Muñoz, Constanza Reyes, Joan Villena +3
    International journal of molecular sciencesPeer-reviewedCC BYFull textOrganic chemistryEurope PMCCrossref
  4. Plastic-Zone-Controlled Grouting Rehabilitation of Deep Soft-Rock Chambers under Ultra-High Stress: Mechanism and Application
    Peng He, Gang Li, Zhiyong Fu +5
    ACS omegaPeer-reviewedCC BY-NC-NDFull textGeneral chemistryEurope PMC
  5. A Review of Grain Boundaries: Formation Mechanism, Synthesis Strategy, and Application in Electrocatalysis
    Jingyu Gao, Fengming Zhou, Xinying Li +6
    EcoEnergyPeer-reviewedCC BYFull text2 citedElectrochemistry & energyDOAJ

Cite

BibTeXRIS
BibTeX
@article{liu2026mechanism,
  title = {{Mechanism and Application of Imidazolium Derivatives as a Bifunctional Additive for Void-free Blind via Copper Filling}},
  author = {Haoying Liu and Yuli Zhang and Yusa Geng and Yuanyuan Xu and Dongxue Qin and Xusen Li and Cong Gao and Shipeng Chen},
  journal = {ACS Omega},
  year = {2026},
  month = oct,
  doi = {10.1021/acsomega.6c06002},
  url = {https://pubs.acs.org/acsodf/article/doi/10.1021/acsomega.6c06002/5453578/Mechanism-and-Application-of-Imidazolium},
  note = {CC BY-NC-ND 4.0},
}
RIS
TY  - JOUR
TI  - Mechanism and Application of Imidazolium Derivatives as a Bifunctional Additive for Void-free Blind via Copper Filling
AU  - Haoying Liu
AU  - Yuli Zhang
AU  - Yusa Geng
AU  - Yuanyuan Xu
AU  - Dongxue Qin
AU  - Xusen Li
AU  - Cong Gao
AU  - Shipeng Chen
PY  - 2026
DA  - 2026/10/19
JO  - ACS Omega
DO  - 10.1021/acsomega.6c06002
UR  - https://pubs.acs.org/acsodf/article/doi/10.1021/acsomega.6c06002/5453578/Mechanism-and-Application-of-Imidazolium
AB  - In conventional acidic copper electroplating, the accelerator and leveler are typically provided by different molecules, resulting in complex additive formulations and difficult-to-control intermolecular interactions. This study proposes an “intramolecular functional group division” strategy and designs a series of imidazolium salts bearing different substituents as bifunctional additives, integrating the leveling function of the imidazolium cation and the accelerating function of the pendant groups within a single molecule. Electrochemical measurements, electroplating of silicon-based micro blind vias, and multi-scale characterization demonstrate that a simplified binary system consisting solely of this additive and PEG8000 can achieve void-free superconformal filling. Systematic comparison of four imidazole derivatives containing sulfonate, cyano, and carboxyl substituents establishes a clear structure–activity relationship: the sulfonate group is the key moiety that confers the accelerating effect, Cl– bridging is a prerequisite for strong adsorption, and the structural basis for acceleration is that the sulfonate group remains exposed on the outer surface without participating in copper-surface adsorption. DFT calculations further elucidate this mechanism from the perspectives of electronic structure and adsorption configuration. This work elevates the integration of dual functions in copper electroplating additives from intermolecular synergy to the single-molecule level, providing a new paradigm for the design of multifunctional electroplating additives.
SN  - 2470-1343
ER  -