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PreprintLicence not statedChemRxiv

Plasma-Enhanced Atomic Layer Deposition and Substrate Engineering of Low-Resistivity Ultrathin MoCx Films for Advanced Interconnect Applications

  • Zeyu Cao1,2
  • Heng-Ray Chuang1,2
  • Brayden Kauffmann3,2
  • Ram Munde1,2
  • Raisul Islam1,2,4
4 affiliations
  1. 1School of Materials Engineering
  2. 2Purdue University
  3. 3School of Physics and Astronomy
  4. 4Elmore Family School of Electrical and Computer Engineering
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Cite

BibTeXRIS
BibTeX
@misc{cao2026plasmaenhanced,
  title = {{Plasma-Enhanced Atomic Layer Deposition and Substrate Engineering of Low-Resistivity Ultrathin MoCx Films for Advanced Interconnect Applications}},
  author = {Zeyu Cao and Heng-Ray Chuang and Brayden Kauffmann and Ram Munde and Raisul Islam},
  howpublished = {ChemRxiv},
  year = {2026},
  month = nov,
  doi = {10.26434/chemrxiv.15011451/v1},
  url = {https://chemrxiv.org/doi/full/10.26434/chemrxiv.15011451/v1},
}
RIS
TY  - UNPB
TI  - Plasma-Enhanced Atomic Layer Deposition and Substrate Engineering of Low-Resistivity Ultrathin MoCx Films for Advanced Interconnect Applications
AU  - Zeyu Cao
AU  - Heng-Ray Chuang
AU  - Brayden Kauffmann
AU  - Ram Munde
AU  - Raisul Islam
PY  - 2026
DA  - 2026/11/01
PB  - ChemRxiv
DO  - 10.26434/chemrxiv.15011451/v1
UR  - https://chemrxiv.org/doi/full/10.26434/chemrxiv.15011451/v1
ER  -