3D WO3 nanostructuration for high power energy storage micro-devices
Abstract
The key technical challenge in developing high-performance micro-energy storage systems based on thin films that offer enhanced rate performance and cycling stability is to find low-energy, time-consuming methodologies for depositing thick, conformal films on complex 3D architectures. This work addresses this challenge by presenting a chemical solution deposition approach based on spin coating, which can deposit WO₃ thin films with a thickness ranging from 100 to 500 nm on high-aspect-ratio 3D silicon substrates. Combining an optimized 3D substrate with a high AEF and an optimized film thickness results in the electrodes exhibiting a 30-fold increase in capacity compared to 2D planar counterparts, in line with the area enlargement factor. Electrochemical evaluations demonstrate stable capacity of 320 µAh cm⁻², even when the potential is limited to prevent conversion reactions. Furthermore, a capacity of 82 µAh cm⁻² is retained at a high current density of 500 µA cm⁻². The improved rate capability is attributed to the expanded surface area of the 3D electrode, the reversible Li+ intercalation mechanism and the nanoscale WO3 structure, which minimize Li ion paths.
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BibTeX
@article{poirot2026nanostructuration,
title = {{3D WO3 nanostructuration for high power energy storage micro-devices}},
author = {N. Poirot and M. Gabard and R. Omnée and M. Zaghrioui and V. Grimal and M. Dutour and E. Raymundo-Piñero},
journal = {Journal of Power Sources},
year = {2026},
month = sep,
doi = {10.1016/j.jpowsour.2026.241592},
url = {https://hal.science/hal-05796788v1},
note = {CC BY 4.0},
}
RIS
TY - JOUR
TI - 3D WO3 nanostructuration for high power energy storage micro-devices
AU - N. Poirot
AU - M. Gabard
AU - R. Omnée
AU - M. Zaghrioui
AU - V. Grimal
AU - M. Dutour
AU - E. Raymundo-Piñero
PY - 2026
DA - 2026/09/28
JO - Journal of Power Sources
DO - 10.1016/j.jpowsour.2026.241592
UR - https://hal.science/hal-05796788v1
AB - The key technical challenge in developing high-performance micro-energy storage systems based on thin films that offer enhanced rate performance and cycling stability is to find low-energy, time-consuming methodologies for depositing thick, conformal films on complex 3D architectures. This work addresses this challenge by presenting a chemical solution deposition approach based on spin coating, which can deposit WO₃ thin films with a thickness ranging from 100 to 500 nm on high-aspect-ratio 3D silicon substrates. Combining an optimized 3D substrate with a high AEF and an optimized film thickness results in the electrodes exhibiting a 30-fold increase in capacity compared to 2D planar counterparts, in line with the area enlargement factor. Electrochemical evaluations demonstrate stable capacity of 320 µAh cm⁻², even when the potential is limited to prevent conversion reactions. Furthermore, a capacity of 82 µAh cm⁻² is retained at a high current density of 500 µA cm⁻². The improved rate capability is attributed to the expanded surface area of the 3D electrode, the reversible Li+ intercalation mechanism and the nanoscale WO3 structure, which minimize Li ion paths.
SN - 0378-7753
SN - 1873-2755
ER -