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Peer-reviewedCC BY 4.0Nanomaterials

Probing Interfacial Thermal Conductance Under Extremely Large Temperature Differences via Ultrafast X-Ray Diffraction

  • Shijie Duan1
  • Jiahao Chen1,2,3
  • Changqin Liu1,2,3
  • Xiaojuan Yuan1,2,3
  • Yifei Li4
  • Jinguang Wang4
  • Xin Lu4,5
  • Dongdong Kang1,2,3
  • Jiayu Dai1,2,3
  • Xiaoxiang Yu1,2,3
5 affiliations
  1. 1College of Science, National University of Defense Technology, Changsha 410073, China
  2. 2Hunan Key Laboratory of Extreme Matter and Applications, National University of Defense Technology, Changsha 410073, China
  3. 3Hunan Research Center of the Basic Discipline for Physical States, National University of Defense Technology, Changsha 410073, China
  4. 4Beijing National Laboratory of Condensed Matter Physics, Institute of Physics, Chinese Academy of Sciences, Beijing 100190, China
  5. 5School of Physical Sciences, University of Chinese Academy of Sciences, Beijing 101408, China
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Abstract

Probing the interfacial thermal transport under extremely large temperature difference (ELTD) is critical for thermal protection and heat dissipation in extreme environments yet challenging. However, conventional optical thermoreflectance methods work only over narrow temperature ranges and thus fail for ELTD conditions characterized by a broad temperature evolution range. Here, we circumvent this limitation by employing a table-top ultrafast X-ray diffraction (UXRD) system, which exploits the nearly linear lattice thermal expansion over a wide temperature range. We investigate interfacial thermal transport in a W thin film on a MgO substrate under ELTD conditions and determine that the interfacial thermal conductance (ITC) value increases from 6.43 × 108 W m−2 K−1 to 8.71 × 108 W m−2 K−1 as the maximum temperature of W rises from 670 K to 2334 K, accompanied by an increase in the maximum interface temperature difference from 302 K to 1451 K based on the finite volume method (FVM). The results reside at a relatively high level among reported ITC values for conventional metal-oxide interfaces, which may originate from the simultaneous increase in interface temperature difference and mean interface temperature. This work demonstrates UXRD as an effective tool for ELTD thermal measurements and fills a critical knowledge gap regarding interfacial thermal transport under extreme conditions.

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Cite

BibTeXRIS
BibTeX
@article{duan2026probing,
  title = {{Probing Interfacial Thermal Conductance Under Extremely Large Temperature Differences via Ultrafast X-Ray Diffraction}},
  author = {Shijie Duan and Jiahao Chen and Changqin Liu and Xiaojuan Yuan and Yifei Li and Jinguang Wang and Xin Lu and Dongdong Kang and Jiayu Dai and Xiaoxiang Yu},
  journal = {Nanomaterials},
  year = {2026},
  month = oct,
  doi = {10.3390/nano16211360},
  url = {https://www.mdpi.com/2079-4991/16/21/1360},
  note = {CC BY 4.0},
}
RIS
TY  - JOUR
TI  - Probing Interfacial Thermal Conductance Under Extremely Large Temperature Differences via Ultrafast X-Ray Diffraction
AU  - Shijie Duan
AU  - Jiahao Chen
AU  - Changqin Liu
AU  - Xiaojuan Yuan
AU  - Yifei Li
AU  - Jinguang Wang
AU  - Xin Lu
AU  - Dongdong Kang
AU  - Jiayu Dai
AU  - Xiaoxiang Yu
PY  - 2026
DA  - 2026/10/25
JO  - Nanomaterials
DO  - 10.3390/nano16211360
UR  - https://www.mdpi.com/2079-4991/16/21/1360
AB  - Probing the interfacial thermal transport under extremely large temperature difference (ELTD) is critical for thermal protection and heat dissipation in extreme environments yet challenging. However, conventional optical thermoreflectance methods work only over narrow temperature ranges and thus fail for ELTD conditions characterized by a broad temperature evolution range. Here, we circumvent this limitation by employing a table-top ultrafast X-ray diffraction (UXRD) system, which exploits the nearly linear lattice thermal expansion over a wide temperature range. We investigate interfacial thermal transport in a W thin film on a MgO substrate under ELTD conditions and determine that the interfacial thermal conductance (ITC) value increases from 6.43 × 108 W m−2 K−1 to 8.71 × 108 W m−2 K−1 as the maximum temperature of W rises from 670 K to 2334 K, accompanied by an increase in the maximum interface temperature difference from 302 K to 1451 K based on the finite volume method (FVM). The results reside at a relatively high level among reported ITC values for conventional metal-oxide interfaces, which may originate from the simultaneous increase in interface temperature difference and mean interface temperature. This work demonstrates UXRD as an effective tool for ELTD thermal measurements and fills a critical knowledge gap regarding interfacial thermal transport under extreme conditions.
SN  - 2079-4991
ER  -