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Peer-reviewedCC BYMaterials (Basel, Switzerland)

A Numerical Study of the Microstructure-Dependent Thermal Conductivity of Diamond-Reinforced Sintered Silver Composites

  • Zhengyang Tian1
  • Jianxin Wu1
  • Lunhu Hu1
  • Yutai Su2
  • Tiancai Cheng1
  1. 1School of Mechanical Engineering, , Hohhot 010051, China; (Z.T.); (J.W.); (T.C.)
  2. 2School of Mechanics and Transportation Engineering, , Xi’an 710129, China
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Cite

BibTeXRIS
BibTeX
@article{tian2026numerical,
  title = {{A Numerical Study of the Microstructure-Dependent Thermal Conductivity of Diamond-Reinforced Sintered Silver Composites}},
  author = {Zhengyang Tian and Jianxin Wu and Lunhu Hu and Yutai Su and Tiancai Cheng},
  journal = {Materials (Basel, Switzerland)},
  year = {2026},
  month = oct,
  url = {https://europepmc.org/article/PMC/PMC13665966},
  note = {CC BY},
}
RIS
TY  - JOUR
TI  - A Numerical Study of the Microstructure-Dependent Thermal Conductivity of Diamond-Reinforced Sintered Silver Composites
AU  - Zhengyang Tian
AU  - Jianxin Wu
AU  - Lunhu Hu
AU  - Yutai Su
AU  - Tiancai Cheng
PY  - 2026
DA  - 2026/10/01
JO  - Materials (Basel, Switzerland)
UR  - https://europepmc.org/article/PMC/PMC13665966
SN  - 1996-1944
ER  -