The balance of thermal conductivity and stability of diamond/Cu composites through interfacial design of Cr–CuCr dual coatings
- 1College of Materials Science and Engineering, Changsha University of Science & Technology, Changsha 410014, PR China
- 2State Key Laboratory of Powder Metallurgy, Central South University, Changsha 410083, PR China
- 3Hunan Xinjuneng Technology Co., Ltd, Changsha 410083, PR China
Abstract
Interface design and optimization is critical to enhance the interfacial bonding and thermal properties of the diamond/Cu composites. Herein, Cr and CuCr30 dual coatings with the different thickness on diamond particles were deposited by magnetron sputtering. The Cr element on diamond particles transformed to Cr 3 C 2 during sintering, with coexisting interfacial phases of Cr 3 C 2 and Cu to strengthen the interface bonding. Relatively thicker interlayers (∼200 nm and ∼270 nm) act as an effective bridge between diamond and Cu, improving wettability and reducing thermal stress, where no obvious debonding was found and the compact diamond/Cu composites were achieved. The results suggest that the interface structure evolution plays a critical role in determining the thermal conductivity, CTE and thermal cycling behavior of diamond/Cu composites. By measuring the thermal conductivity before and after thermal cycling, we found that the composites with an intermediate thickness of the interlayer possessed the maximum thermal conductivity (686 W/mK), while that with a thicker interlayer presented a better comprehensive performance with a relatively high initial thermal conductivity (646 W/mK), compatible CTE (7.49×10 -6 /K from room temperature to 200 °C) and stable thermal cycling performance (4% attenuation of thermal conductivity for 300 cycles from -50 °C to 150 °C). This work demonstrates that a trade-off exists between maximizing initial thermal conductivity and ensuring long-term thermal stability for diamond/Cu composites.
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BibTeX
@article{hu2026balance,
title = {{The balance of thermal conductivity and stability of diamond/Cu composites through interfacial design of Cr–CuCr dual coatings}},
author = {Wentao Hu and Zengkai Jiao and Kaitang Huang and Long Zhang and Changyu Yin and Yangfan Liao and Hongtao Yu and Haiyun Yang and Yonggang Wang and Li Ma and Qiuping Wei and Kechao Zhou},
journal = {Journal of Materials Research and Technology},
year = {2026},
month = jun,
doi = {10.1016/j.jmrt.2026.06.067},
url = {https://doi.org/10.1016/j.jmrt.2026.06.067},
note = {CC BY-NC-ND},
}
RIS
TY - JOUR
TI - The balance of thermal conductivity and stability of diamond/Cu composites through interfacial design of Cr–CuCr dual coatings
AU - Wentao Hu
AU - Zengkai Jiao
AU - Kaitang Huang
AU - Long Zhang
AU - Changyu Yin
AU - Yangfan Liao
AU - Hongtao Yu
AU - Haiyun Yang
AU - Yonggang Wang
AU - Li Ma
AU - Qiuping Wei
AU - Kechao Zhou
PY - 2026
DA - 2026/06/08
JO - Journal of Materials Research and Technology
DO - 10.1016/j.jmrt.2026.06.067
UR - https://doi.org/10.1016/j.jmrt.2026.06.067
AB - Interface design and optimization is critical to enhance the interfacial bonding and thermal properties of the diamond/Cu composites. Herein, Cr and CuCr30 dual coatings with the different thickness on diamond particles were deposited by magnetron sputtering. The Cr element on diamond particles transformed to Cr 3 C 2 during sintering, with coexisting interfacial phases of Cr 3 C 2 and Cu to strengthen the interface bonding. Relatively thicker interlayers (∼200 nm and ∼270 nm) act as an effective bridge between diamond and Cu, improving wettability and reducing thermal stress, where no obvious debonding was found and the compact diamond/Cu composites were achieved. The results suggest that the interface structure evolution plays a critical role in determining the thermal conductivity, CTE and thermal cycling behavior of diamond/Cu composites. By measuring the thermal conductivity before and after thermal cycling, we found that the composites with an intermediate thickness of the interlayer possessed the maximum thermal conductivity (686 W/mK), while that with a thicker interlayer presented a better comprehensive performance with a relatively high initial thermal conductivity (646 W/mK), compatible CTE (7.49×10 -6 /K from room temperature to 200 °C) and stable thermal cycling performance (4% attenuation of thermal conductivity for 300 cycles from -50 °C to 150 °C). This work demonstrates that a trade-off exists between maximizing initial thermal conductivity and ensuring long-term thermal stability for diamond/Cu composites.
SN - 2214-0697
SN - 2238-7854
ER -