Integrated Microwave Photonics: From Material Platforms to Systems-on-Chip
Abstract
In this paper, recent advances in integrated microwave photonics (IMWP) are reviewed, including material platforms, integration technologies, and system functionalities. Emerging opportunities and future perspectives are discussed. Silicon (Si) and silicon nitride (SiN) provide dense routing, programmable filtering, and low-loss delay; indium phosphide (InP) supplies optical gain, light generation, and high-speed photodetection; thin-film lithium niobate (TFLN) offers linear and broadband electro-optic conversion; and photonic integration is emerging as a practical path to synergize complementary capabilities. Recent work shows a marked shift from isolated modulators, filters, and delay lines toward chip- and module-level systems, ranging from signal processing engines, real-time spectrum sensing, to full-spectrum wireless links, fiber-wireless conversion, silicon beamforming, integrated radar, programmable processors, and photonic convolution engines with on-chip sources and detectors. As these demonstrations become more mature and complete, the key questions move beyond bandwidth and efficiency toward system integration, microwave packaging, calibration stability, analog link performance, and application-level validation.
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BibTeX
@misc{zhang2026integrated,
title = {{Integrated Microwave Photonics: From Material Platforms to Systems-on-Chip}},
author = {Jiejun Zhang and Jianping Yao},
howpublished = {arXiv},
year = {2026},
month = sep,
doi = {10.48550/arxiv.2608.31146},
eprint = {2608.31146},
archivePrefix = {arXiv},
url = {https://arxiv.org/abs/2608.31146},
}
RIS
TY - UNPB
TI - Integrated Microwave Photonics: From Material Platforms to Systems-on-Chip
AU - Jiejun Zhang
AU - Jianping Yao
PY - 2026
DA - 2026/09/03
PB - arXiv
DO - 10.48550/arxiv.2608.31146
UR - https://arxiv.org/abs/2608.31146
AB - In this paper, recent advances in integrated microwave photonics (IMWP) are reviewed, including material platforms, integration technologies, and system functionalities. Emerging opportunities and future perspectives are discussed. Silicon (Si) and silicon nitride (SiN) provide dense routing, programmable filtering, and low-loss delay; indium phosphide (InP) supplies optical gain, light generation, and high-speed photodetection; thin-film lithium niobate (TFLN) offers linear and broadband electro-optic conversion; and photonic integration is emerging as a practical path to synergize complementary capabilities. Recent work shows a marked shift from isolated modulators, filters, and delay lines toward chip- and module-level systems, ranging from signal processing engines, real-time spectrum sensing, to full-spectrum wireless links, fiber-wireless conversion, silicon beamforming, integrated radar, programmable processors, and photonic convolution engines with on-chip sources and detectors. As these demonstrations become more mature and complete, the key questions move beyond bandwidth and efficiency toward system integration, microwave packaging, calibration stability, analog link performance, and application-level validation.
ER -