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PreprintCC BY 4.0HAL

How does stress evolve during growth of refractory compositionally complex alloy thin films?

Abstract

Understanding stress evolution during growth in multicomponent metallic thin films is essential for controlling their structural and functional stability. Here, we investigate the effect of Ta content (0-60 at.%) on the microstructure and growth stress of TiZrHfTax thin films. Increasing Ta induces a transition from crystalline to amorphous microstructures and significantly modifies both the magnitude and sign of growth stress. Real-time wafer curvature measurements reveal depth-dependent stress variations associated with a peculiar amorphous/bcc dual-phase morphology. Our results provide new insights into stress evolution in refractory compositionally complex alloy films and demonstrate how intrinsic stresses can be tuned through chemistry and phase stability

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BibTeX
@misc{slimani2026does,
  title = {{How does stress evolve during growth of refractory compositionally complex alloy thin films?}},
  author = {Hocine Slimani and Frédéric Pailloux and Chalopin Mériadeg and Jean-Baptiste Dubois and Philippe DJEMIA and Matteo Ghidelli and Grégory Abadias},
  howpublished = {HAL},
  year = {2026},
  month = oct,
  url = {https://cnrs.hal.science/hal-05804780v1},
  note = {CC BY 4.0},
}
RIS
TY  - UNPB
TI  - How does stress evolve during growth of refractory compositionally complex alloy thin films?
AU  - Hocine Slimani
AU  - Frédéric Pailloux
AU  - Chalopin Mériadeg
AU  - Jean-Baptiste Dubois
AU  - Philippe DJEMIA
AU  - Matteo Ghidelli
AU  - Grégory Abadias
PY  - 2026
DA  - 2026/10/18
PB  - HAL
UR  - https://cnrs.hal.science/hal-05804780v1
AB  - Understanding stress evolution during growth in multicomponent metallic thin films is essential for controlling their structural and functional stability. Here, we investigate the effect of Ta content (0-60 at.%) on the microstructure and growth stress of TiZrHfTax thin films. Increasing Ta induces a transition from crystalline to amorphous microstructures and significantly modifies both the magnitude and sign of growth stress. Real-time wafer curvature measurements reveal depth-dependent stress variations associated with a peculiar amorphous/bcc dual-phase morphology. Our results provide new insights into stress evolution in refractory compositionally complex alloy films and demonstrate how intrinsic stresses can be tuned through chemistry and phase stability
ER  -