Ultra-thin WS2 growth by ALD from bis(tert-butylimido)bis(dimethylamido)tungsten and 1,2-ethanedithiol and detailed surface mechanism
6 affiliations
- 1IRCELYON – UMR 5256, Universite Claude Bernard Lyon 1, CNRS, 2 Avenue Albert Einstein, Villeurbanne Cedex, France, 69626
- 2Laboratory of Catalysis, Polymerization, Processes and Materials (CP2M UMR 5128), CNRS, CPE Lyon, 43 Bd du 11 Novembre 1918, Villeurbanne, France, 69616
- 3CNRS, LTDS (UMR5513), Ecole Centrale de Lyon, Université de Lyon, - 36 Av. Guy de Collongue, Ecully, France, 69130
- 4CNRS, MATEIS (UMR5510), INSA de Lyon, Universite Claude Bernard Lyon, 7 avenue Jean Capelle, Villeurbanne, 69621
- 5Chemistry laboratory
- 6ENS Lyon 46 allée d’Italie
Abstract
A molecular layer deposition/atomic layer deposition (MLD/ALD) strategy using bis(tert-butylimido)bis(dimethylamido)tungsten (BTBMW) and 1,2-ethanedithiol (EDT), the latter serving as a safer organic alternative to H2S, leads to the formation of ultrathin WS2 films via a molecular/hybrid tungsten organothiolate intermediate. A multiscale approach, involving Si/SiO2 wafers, silica nanobeads, and molecular models, provides mechanistic insight into the early stages of growth. It reveals a complex surface chemistry involving ligand exchange, partial reduction of tungsten, and degrafting processes with regeneration of Si-OH groups. Despite this complexity, the process evolves toward a self-limiting and reproducible growth regime. Annealing studies on Si/SiO2 wafers and silica nanobeads allow tracking the transformation of the organothiolate intermediate into crystalline WS2 and confirm that WS2 formation proceeds through a progressive and controlled conversion of the deposited phase into lamellar WS2 domains. The mechanistic study also suggests that the degrafting-induced mobility of thiolate species during deposition may contribute to the lateral growth observed during annealing.
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BibTeX
@misc{qoraiche2026ultrathin,
title = {{Ultra-thin WS2 growth by ALD from bis(tert-butylimido)bis(dimethylamido)tungsten and 1,2-ethanedithiol and detailed surface mechanism}},
author = {Zakaria Qoraiche and Medet Zhukush and Jules Galipaud and Laurent Veyre and Kai Szeto and Mimoun Aouine and Lhoussain Khrouz and Clément Camp and Elsje Alessandra Quadrelli},
howpublished = {ChemRxiv},
year = {2026},
month = sep,
doi = {10.26434/chemrxiv.15009219/v1},
url = {https://chemrxiv.org/doi/full/10.26434/chemrxiv.15009219/v1},
note = {CC BY},
}
RIS
TY - UNPB
TI - Ultra-thin WS2 growth by ALD from bis(tert-butylimido)bis(dimethylamido)tungsten and 1,2-ethanedithiol and detailed surface mechanism
AU - Zakaria Qoraiche
AU - Medet Zhukush
AU - Jules Galipaud
AU - Laurent Veyre
AU - Kai Szeto
AU - Mimoun Aouine
AU - Lhoussain Khrouz
AU - Clément Camp
AU - Elsje Alessandra Quadrelli
PY - 2026
DA - 2026/09/21
PB - ChemRxiv
DO - 10.26434/chemrxiv.15009219/v1
UR - https://chemrxiv.org/doi/full/10.26434/chemrxiv.15009219/v1
AB - A molecular layer deposition/atomic layer deposition (MLD/ALD) strategy using bis(tert-butylimido)bis(dimethylamido)tungsten (BTBMW) and 1,2-ethanedithiol (EDT), the latter serving as a safer organic alternative to H2S, leads to the formation of ultrathin WS2 films via a molecular/hybrid tungsten organothiolate intermediate. A multiscale approach, involving Si/SiO2 wafers, silica nanobeads, and molecular models, provides mechanistic insight into the early stages of growth. It reveals a complex surface chemistry involving ligand exchange, partial reduction of tungsten, and degrafting processes with regeneration of Si-OH groups. Despite this complexity, the process evolves toward a self-limiting and reproducible growth regime. Annealing studies on Si/SiO2 wafers and silica nanobeads allow tracking the transformation of the organothiolate intermediate into crystalline WS2 and confirm that WS2 formation proceeds through a progressive and controlled conversion of the deposited phase into lamellar WS2 domains. The mechanistic study also suggests that the degrafting-induced mobility of thiolate species during deposition may contribute to the lateral growth observed during annealing.
SN - 2573-2293
ER -