A Biobased Epoxy Resin with Sequential Thermoplastic-to-Thermoset Curing Enables Removable-to-Permanent Adhesive Bonding
Abstract
Adhesives are commonly designed either as reworkable thermoplastics or permanently crosslinked thermosets. Here, sequential thermoplastic-to-thermoset curing enables a simple two-component formulation based on a bio-based epoxy resin to function first as a removable hot-melt adhesive and subsequently as a permanent structural adhesive. Reaction of diglycidyl ether of vanillyl alcohol (DGEVA) and anilinium methanesulfonate at 110 °C produces a thermoplastic intermediate that is solid at room temperature but flows upon reheating and dissolves in selected solvents. This intermediate forms load-bearing joints that can be thermally debonded and rebonded or disassembled by dissolution. Further heating induces crosslinking and converts the same adhesive layer into a permanent epoxy network, increasing the apparent lap-shear strength nearly eightfold and rendering the joint resistant to disassembly under the same solvent conditions. This curing sequence therefore assigns reworkability and high-strength permanent bonding to successive adhesive states within the same formulation.
Related
- Rapid Fabrication of Round Flexdym Microchannels via Direct PDMS (Thermoset)-to-Flexdym (Thermoplastic) Thermal Replication
- Raman Spectroscopy–Evolved Gas Analysis–Mass Spectrometry Provides Insight into Thermoset Thermal Degradation
- Biobased Cyclic Enoate Monomers: Enabling Intrinsically Crystalline, Chemically Recyclable, Ultratough Polymers
- Cross-Linking Simulation at Metal Oxide-Thermoset Interfaces Using Quantum Chemical and Molecular Dynamics Methods
- Scalable Thermoset Informatics Integrated with Autonomous Experimentation for On-Demand Discovery
BibTeX
@misc{kurowska2026biobased,
title = {{A Biobased Epoxy Resin with Sequential Thermoplastic-to-Thermoset Curing Enables Removable-to-Permanent Adhesive Bonding}},
author = {Izabela Kurowska and Kaan Yorganci and Nora Aranburu and Itxaso Calafel and Amaia Agirre and Leire Unanue and Itziar Otaegi and Nerea Casado and Ibon Odriozola and David Mecerreyes},
howpublished = {ChemRxiv},
year = {2026},
month = oct,
doi = {10.26434/chemrxiv.15009986/v1},
url = {https://chemrxiv.org/doi/full/10.26434/chemrxiv.15009986/v1},
note = {CC BY-NC-ND},
}
RIS
TY - UNPB
TI - A Biobased Epoxy Resin with Sequential Thermoplastic-to-Thermoset Curing Enables Removable-to-Permanent Adhesive Bonding
AU - Izabela Kurowska
AU - Kaan Yorganci
AU - Nora Aranburu
AU - Itxaso Calafel
AU - Amaia Agirre
AU - Leire Unanue
AU - Itziar Otaegi
AU - Nerea Casado
AU - Ibon Odriozola
AU - David Mecerreyes
PY - 2026
DA - 2026/10/06
PB - ChemRxiv
DO - 10.26434/chemrxiv.15009986/v1
UR - https://chemrxiv.org/doi/full/10.26434/chemrxiv.15009986/v1
AB - Adhesives are commonly designed either as reworkable thermoplastics or permanently crosslinked thermosets. Here, sequential thermoplastic-to-thermoset curing enables a simple two-component formulation based on a bio-based epoxy resin to function first as a removable hot-melt adhesive and subsequently as a permanent structural adhesive. Reaction of diglycidyl ether of vanillyl alcohol (DGEVA) and anilinium methanesulfonate at 110 °C produces a thermoplastic intermediate that is solid at room temperature but flows upon reheating and dissolves in selected solvents. This intermediate forms load-bearing joints that can be thermally debonded and rebonded or disassembled by dissolution. Further heating induces crosslinking and converts the same adhesive layer into a permanent epoxy network, increasing the apparent lap-shear strength nearly eightfold and rendering the joint resistant to disassembly under the same solvent conditions. This curing sequence therefore assigns reworkability and high-strength permanent bonding to successive adhesive states within the same formulation.
ER -