Testbeam characterization of a 3D silicon sensor read out by Timepix4
Abstract
Testbeam results from a 300 μm-thick 3D silicon sensor bump-bonded to a Timepix4 ASIC, are presented. The hit detection efficiency, spatial resolution, and timing performance of the 3D sensor are studied for several track angles, bias voltages and charge thresholds. The time measurements are corrected for Timepix4 clock-frequency variations and timewalk, while for the spatial studies, nonlinear charge-sharing corrections are determined. At perpendicular incidence, the time resolution of the 3D detector is equal to 245 ps with a 97% hit detection efficiency. An optimal angle of 8∘ with respect to the beam direction of the 3D detector was found, in which the time resolution improves by 6% compared to normal incidence, while the hit detection efficiency reaches above 99% and the spatial resolution is approximately 7 μm. Intrapixel studies show that a time resolution of 153 ps at the most probable value of the signal charge can be achieved for hits between the electrodes at normal incidence, while the timing performance of these best-performing regions deteriorate upon sensor rotation. The timing properties at different depths of the 3D sensor have been investigated with tracks at grazing-angle incidence, revealing a dependence of the time resolution along the sensor depth.
Related
- Photon-pair characterization in an amorphous silicon waveguide
- Broadband effective-loss characterization and application bounds of compact silicon nitride spiral waveguides
- Characterization of CharTPix-180A, a strip-shaped monolithic sensor for the STCF inner tracker
- A flexible electronics and DAQ system for the Timepix4 ASIC
- Neural network-based timewalk correction for the Timepix4 ASIC
BibTeX
@misc{chatzianagnostou2026testbeam,
title = {{Testbeam characterization of a 3D silicon sensor read out by Timepix4}},
author = {E. Chatzianagnostou and M. J. Madurai and K. Akiba and D. Bacher and R. Bates and M. van Beuzekom and T. Bischoff and V. Coco and R. Dumps and T. Evans and K. Heijhoff and D. Johnson and U. Krämer and E. Lemos Cid and D. Oppenhuis and T. Pajero and E. Rodríguez Rodríguez and D. Rolf},
howpublished = {arXiv},
year = {2026},
month = sep,
doi = {10.48550/arxiv.2609.04042},
eprint = {2609.04042},
archivePrefix = {arXiv},
url = {https://arxiv.org/abs/2609.04042},
note = {CC BY 4.0},
}
RIS
TY - UNPB
TI - Testbeam characterization of a 3D silicon sensor read out by Timepix4
AU - E. Chatzianagnostou
AU - M. J. Madurai
AU - K. Akiba
AU - D. Bacher
AU - R. Bates
AU - M. van Beuzekom
AU - T. Bischoff
AU - V. Coco
AU - R. Dumps
AU - T. Evans
AU - K. Heijhoff
AU - D. Johnson
AU - U. Krämer
AU - E. Lemos Cid
AU - D. Oppenhuis
AU - T. Pajero
AU - E. Rodríguez Rodríguez
AU - D. Rolf
PY - 2026
DA - 2026/09/03
PB - arXiv
DO - 10.48550/arxiv.2609.04042
UR - https://arxiv.org/abs/2609.04042
AB - Testbeam results from a 300 μm-thick 3D silicon sensor bump-bonded to a Timepix4 ASIC, are presented. The hit detection efficiency, spatial resolution, and timing performance of the 3D sensor are studied for several track angles, bias voltages and charge thresholds. The time measurements are corrected for Timepix4 clock-frequency variations and timewalk, while for the spatial studies, nonlinear charge-sharing corrections are determined. At perpendicular incidence, the time resolution of the 3D detector is equal to 245 ps with a 97% hit detection efficiency. An optimal angle of 8^∘ with respect to the beam direction of the 3D detector was found, in which the time resolution improves by 6% compared to normal incidence, while the hit detection efficiency reaches above 99% and the spatial resolution is approximately 7 μm. Intrapixel studies show that a time resolution of 153 ps at the most probable value of the signal charge can be achieved for hits between the electrodes at normal incidence, while the timing performance of these best-performing regions deteriorate upon sensor rotation. The timing properties at different depths of the 3D sensor have been investigated with tracks at grazing-angle incidence, revealing a dependence of the time resolution along the sensor depth.
ER -