PreprintCC BY 4.0arXiv
Development of LGAD Sensor Technology on 12 inch Wafers for 3D Integration with advanced CMOS processes
Abstract
We report on the design, simulation, and initial testing of Low Gain Avalanche Diode (LGAD) sensors fabricated in 65 nm CMOS technology on 12 inch wafers. These sensors were developed as part of a project to demonstrate full wafer to wafer hybrid bonding of sensors and 28 nm Readout Integrated Circuits (ROICs). The sensor submission and test included standard (reach-through) LGADs, AC coupled LGADs, and Deep Junction LGADs as well as various test structures.
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BibTeX
@misc{lipton2026development,
title = {{Development of LGAD Sensor Technology on 12 inch Wafers for 3D Integration with advanced CMOS processes}},
author = {Ron Lipton and Julie Segal and Angela Kok and Troy England and Artur Apresyan and Davide Braga and Farah Fahim and Shuoxing Wu and Christopher Kenney and Bojan Markovic and Ariel Gustavo Schwartzman and Lorenzo Rota and Arthur Carpenter},
howpublished = {arXiv},
year = {2026},
month = sep,
doi = {10.48550/arxiv.2609.35861},
eprint = {2609.35861},
archivePrefix = {arXiv},
url = {https://arxiv.org/abs/2609.35861},
note = {CC BY 4.0},
}
RIS
TY - UNPB
TI - Development of LGAD Sensor Technology on 12 inch Wafers for 3D Integration with advanced CMOS processes
AU - Ron Lipton
AU - Julie Segal
AU - Angela Kok
AU - Troy England
AU - Artur Apresyan
AU - Davide Braga
AU - Farah Fahim
AU - Shuoxing Wu
AU - Christopher Kenney
AU - Bojan Markovic
AU - Ariel Gustavo Schwartzman
AU - Lorenzo Rota
AU - Arthur Carpenter
PY - 2026
DA - 2026/09/25
PB - arXiv
DO - 10.48550/arxiv.2609.35861
UR - https://arxiv.org/abs/2609.35861
AB - We report on the design, simulation, and initial testing of Low Gain Avalanche Diode (LGAD) sensors fabricated in 65 nm CMOS technology on 12 inch wafers. These sensors were developed as part of a project to demonstrate full wafer to wafer hybrid bonding of sensors and 28 nm Readout Integrated Circuits (ROICs). The sensor submission and test included standard (reach-through) LGADs, AC coupled LGADs, and Deep Junction LGADs as well as various test structures.
ER -