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PreprintCC BY 4.0HAL

Near-field Ultrafast Nondiffractive Laser Nanoscale Cutting of Glass with Quasi-null Interface Roughness

Abstract

Generally, ultrafast laser glass dicing is governed by explosive material removal, which restricts the achievable surface roughness. Here we report single-step dicing of aluminosilicate glass with residual interface roughness below 5 nm, producing optical-quality surfaces without post-processing, using near-field-enhanced 0th-order Bessel-Gauss beams. This exceptional interface quality cannot be explained by a conventional laser ablation mechanism, such as phase explosion, melt expulsion, or fracture-dominated material removal. Instead, quantitative analysis of local thermal dynamics indicates that material removal is consistent with a Hertz-Knudsen-type evaporation process, enabling layer-by-layer removal with precision approaching a few molecular layers. These results suggest that nanoscale optical confinement fundamentally alters the response of transparent materials to ultrafast laser irradiation and establish a route toward deterministic laser processing with near-atomic precision.

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BibTeX
@misc{dwivedi2026nearfield,
  title = {{Near-field Ultrafast Nondiffractive Laser Nanoscale Cutting of Glass with Quasi-null Interface Roughness}},
  author = {Rajeev Dwivedi and Anton Rudenko and Guodong Zhang and Xxx Sedao and Yaya Lefkir and Ciro d'Amico and Guanghua Cheng and Razvan Stoian},
  howpublished = {HAL},
  year = {2026},
  month = sep,
  doi = {10.48550/arxiv.2609.39928},
  eprint = {2609.39928},
  archivePrefix = {arXiv},
  url = {https://hal.science/hal-05802996v1},
  note = {CC BY 4.0},
}
RIS
TY  - UNPB
TI  - Near-field Ultrafast Nondiffractive Laser Nanoscale Cutting of Glass with Quasi-null Interface Roughness
AU  - Rajeev Dwivedi
AU  - Anton Rudenko
AU  - Guodong Zhang
AU  - Xxx Sedao
AU  - Yaya Lefkir
AU  - Ciro d'Amico
AU  - Guanghua Cheng
AU  - Razvan Stoian
PY  - 2026
DA  - 2026/09/30
PB  - HAL
DO  - 10.48550/arxiv.2609.39928
UR  - https://hal.science/hal-05802996v1
AB  - Generally, ultrafast laser glass dicing is governed by explosive material removal, which restricts the achievable surface roughness. Here we report single-step dicing of aluminosilicate glass with residual interface roughness below 5 nm, producing optical-quality surfaces without post-processing, using near-field-enhanced 0th-order Bessel-Gauss beams. This exceptional interface quality cannot be explained by a conventional laser ablation mechanism, such as phase explosion, melt expulsion, or fracture-dominated material removal. Instead, quantitative analysis of local thermal dynamics indicates that material removal is consistent with a Hertz-Knudsen-type evaporation process, enabling layer-by-layer removal with precision approaching a few molecular layers. These results suggest that nanoscale optical confinement fundamentally alters the response of transparent materials to ultrafast laser irradiation and establish a route toward deterministic laser processing with near-atomic precision.
ER  -