Leaf Vein-Inspired Hierarchical Point–Line–Plane BNNT/WS2/Ag Welded Network for Efficient Heat Dissipation
- 1Nano-Micro Energy Catalysis Lab, College of Smart Energy, Shanghai Jiao Tong University, Shanghai 200240, China
- 2Department of Physics, Sungkyunkwan University, 2066, Seobu-ro, Jangan-gu, Suwon 16419, Republic of Korea
Abstract
Severe heat buildup within chips limits device stability and service life, and thermally conductive yet electrically insulating polymer nanocomposites become critical thermal interface materials (TIMs) for electronics cooling. The intrinsic interfacial thermal resistance (ITR) between discrete thermally conductive fillers in TIMs remains the core bottleneck limiting thermal conductivity improvement, and rationally constructing three-dimensional (3D) interconnected filler networks represents a feasible and efficient strategy to address this issue. Inspired by the natural hierarchical point–line–plane topological skeleton of a plant leaf, which realizes efficient internal matter transfer via long spicular lines, discoid planar scaffolds, and vein nodes, we design and produce a novel BNNT/WS2/Ag ternary hybrid thermally conductive network within an epoxy matrix. Specifically, high aspect ratio boron nitride nanotubes (BNNTs) act as one-dimensional linear thermal conduction skeletons mimicking leaf veins, while tungsten disulfide (WS2) nanosheets serve as two-dimensional planar heat-collecting and heat-spreading scaffolds with large specific surface areas. Notably, in situ photodeposited silver (Ag) nanoparticles function as biomimetic vein nodes between adjacent fillers. Low-temperature sintering enables these Ag nodes to tightly connect BNNT linear skeletons and WS2 planar nanosheets, effectively bridging isolated thermal conductive units, which is expected to reduce the effective thermal resistance of the composite system. This hierarchical point–line–plane structure constructs a continuous, unobstructed 3D thermal conduction highway inside the epoxy matrix. The resultant BNNT/WS2/Ag/epoxy nanocomposite exhibits excellent thermal conduction performance, with a prominent in-plane thermal conductivity of 21.5 W m−1 K−1 and a high through-plane thermal conductivity of 7.63 W m−1 K−1. Benefiting from the hierarchical topological structure and interconnected conductive network, the as-prepared nanocomposites possess outstanding heat dissipation capability and hold great promise for high-efficiency thermal management in advanced electronic devices.
Related
- Bio-inspired decoration of Ag nanoparticles on eggshell-derived hierarchical CaO-based flower-like architectures for enhanced antibacterial, photocatalytic, and hemocompatible applications
- Bio-inspired surfaces via polydimethylsiloxane treated polycarbonate, for durable and cost-efficient atmospheric water harvesting
- Failure-Mode-Driven Methodology to Unravel Interfacial Chemical Bonding in Laser-Welded Polyamide-6.6–Titanium Interfaces
- Hydrogen bond network disruption enables efficient direct reactive capture of CO2 from flue gas
- Origami-inspired folded-interlocked nanofiber aerogels for thermal insulation
BibTeX
@article{yan2026leaf,
title = {{Leaf Vein-Inspired Hierarchical Point–Line–Plane BNNT/WS2/Ag Welded Network for Efficient Heat Dissipation}},
author = {Changzeng Yan and Xiang Li and Zeyu Dong and Guiying Li and Xiuhua Ma and Yuhan Zhang and Guangqi Bai and Dae Joon Kang},
journal = {Nanomaterials},
year = {2026},
month = oct,
doi = {10.3390/nano16211368},
url = {https://www.mdpi.com/2079-4991/16/21/1368},
note = {CC BY 4.0},
}
RIS
TY - JOUR
TI - Leaf Vein-Inspired Hierarchical Point–Line–Plane BNNT/WS2/Ag Welded Network for Efficient Heat Dissipation
AU - Changzeng Yan
AU - Xiang Li
AU - Zeyu Dong
AU - Guiying Li
AU - Xiuhua Ma
AU - Yuhan Zhang
AU - Guangqi Bai
AU - Dae Joon Kang
PY - 2026
DA - 2026/10/27
JO - Nanomaterials
DO - 10.3390/nano16211368
UR - https://www.mdpi.com/2079-4991/16/21/1368
AB - Severe heat buildup within chips limits device stability and service life, and thermally conductive yet electrically insulating polymer nanocomposites become critical thermal interface materials (TIMs) for electronics cooling. The intrinsic interfacial thermal resistance (ITR) between discrete thermally conductive fillers in TIMs remains the core bottleneck limiting thermal conductivity improvement, and rationally constructing three-dimensional (3D) interconnected filler networks represents a feasible and efficient strategy to address this issue. Inspired by the natural hierarchical point–line–plane topological skeleton of a plant leaf, which realizes efficient internal matter transfer via long spicular lines, discoid planar scaffolds, and vein nodes, we design and produce a novel BNNT/WS2/Ag ternary hybrid thermally conductive network within an epoxy matrix. Specifically, high aspect ratio boron nitride nanotubes (BNNTs) act as one-dimensional linear thermal conduction skeletons mimicking leaf veins, while tungsten disulfide (WS2) nanosheets serve as two-dimensional planar heat-collecting and heat-spreading scaffolds with large specific surface areas. Notably, in situ photodeposited silver (Ag) nanoparticles function as biomimetic vein nodes between adjacent fillers. Low-temperature sintering enables these Ag nodes to tightly connect BNNT linear skeletons and WS2 planar nanosheets, effectively bridging isolated thermal conductive units, which is expected to reduce the effective thermal resistance of the composite system. This hierarchical point–line–plane structure constructs a continuous, unobstructed 3D thermal conduction highway inside the epoxy matrix. The resultant BNNT/WS2/Ag/epoxy nanocomposite exhibits excellent thermal conduction performance, with a prominent in-plane thermal conductivity of 21.5 W m−1 K−1 and a high through-plane thermal conductivity of 7.63 W m−1 K−1. Benefiting from the hierarchical topological structure and interconnected conductive network, the as-prepared nanocomposites possess outstanding heat dissipation capability and hold great promise for high-efficiency thermal management in advanced electronic devices.
SN - 2079-4991
ER -