Terahertz nondestructive evaluation of heterogeneous packaging stackup: Multi-layer interposer
Abstract
With increasing integration density of semiconductor devices, high-speed interconnects and advanced packaging techniques are essential to meet the growing demands of artificial intelligence and large-scale computing. Three-dimensional packaging, where multiple chips are stacked to improve bandwidth and reduce latency have emerged as a promising solution; however, the complex multilayer integration introduces significant manufacturing challenges, including defects such as misalignment, voids, and warpage. Ensuring high manufacturing yields and product reliability requires advanced inspection techniques. In this study, we explore the potential of terahertz electromagnetic waves as a nondestructive-evaluation method for an 8-layer interposer. The effect of polarization on the ability to detect features at depth is discussed. With deconvolution and unsupervised learning algorithms, several defect areas are revealed.
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BibTeX
@article{shi2026terahertz,
title = {{Terahertz nondestructive evaluation of heterogeneous packaging stackup: Multi-layer interposer}},
author = {Haolian Shi and Christopher Blancher and Meghna Narayanan and Pragna Bhaskar and Erwan Emile and Mohanalingam Kathaperumal and Alexandre Locquet and D.S. Citrin},
journal = {Materials Science in Semiconductor Processing},
year = {2026},
month = oct,
doi = {10.1016/j.mssp.2026.111189},
url = {https://hal.science/hal-05785326v1},
note = {CC BY 4.0},
}
RIS
TY - JOUR
TI - Terahertz nondestructive evaluation of heterogeneous packaging stackup: Multi-layer interposer
AU - Haolian Shi
AU - Christopher Blancher
AU - Meghna Narayanan
AU - Pragna Bhaskar
AU - Erwan Emile
AU - Mohanalingam Kathaperumal
AU - Alexandre Locquet
AU - D.S. Citrin
PY - 2026
DA - 2026/10/05
JO - Materials Science in Semiconductor Processing
DO - 10.1016/j.mssp.2026.111189
UR - https://hal.science/hal-05785326v1
AB - With increasing integration density of semiconductor devices, high-speed interconnects and advanced packaging techniques are essential to meet the growing demands of artificial intelligence and large-scale computing. Three-dimensional packaging, where multiple chips are stacked to improve bandwidth and reduce latency have emerged as a promising solution; however, the complex multilayer integration introduces significant manufacturing challenges, including defects such as misalignment, voids, and warpage. Ensuring high manufacturing yields and product reliability requires advanced inspection techniques. In this study, we explore the potential of terahertz electromagnetic waves as a nondestructive-evaluation method for an 8-layer interposer. The effect of polarization on the ability to detect features at depth is discussed. With deconvolution and unsupervised learning algorithms, several defect areas are revealed.
SN - 1369-8001
ER -