Next-generation electronic packaging materials: thermal-dielectric properties and design strategies in PI and PTFE-based composites
- 1Guangdong Provincial Key Laboratory of New Energy Materials Service Safety, College of Materials Science and Engineering, Shenzhen University, Shenzhen, 518060, China
- 2School of Materials Science and Engineering, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China
- 3Shenzhen Key Laboratory of Flexible Printed Electronics Technology, Harbin Institute of Technology (Shenzhen), Shenzhen, 518055, China
Abstract
The rapid advancement of high-frequency and high-power electronic technologies has created an urgent demand for materials that simultaneously exhibit high thermal conductivity, low dielectric constant and loss, and robust mechanical reliability. Polyimide (PI) and polytetrafluoroethylene (PTFE) are among the most promising polymer matrices for advanced electronic packaging owing to their outstanding thermal stability, chemical resistance, and electrical insulation properties. Nevertheless, the relatively high dielectric constant of PI and the poor interfacial adhesion of PTFE and their intrinsically low thermal conductivity significantly limit their direct application in next-generation electronic substrates. This review systematically summarizes recent progress in PI and PTFE-based composite systems, with a particular focus on design strategies, fabrication routes, and structure property relationships governing their multifunctional performance. Various processing techniques are critically evaluated with respect to interfacial engineering, dispersion of fillers, and construction of networks. Emphasis is placed on ceramic, carbon, metal oxide and metallic fillers that enable the formation of efficient thermally conductive yet electrically insulating pathways within PI and PTFE matrices. Furthermore, the roles of surface functionalization, coupling agents, and hierarchical or double-percolation architectures in enhancing phonon transport, suppressing dielectric loss, and improving mechanical integrity are discussed in detail. Finally, current challenges and future perspectives are outlined, including interface optimization, filler alignment control, low-loss dielectric tailoring, and scalable manufacturing strategies for high-frequency applications such as 5G and microwave electronics. This review provides a comprehensive understanding of processing-structure-property correlations in PI-based and PTFE-based composites and offers guidance for the rational design of high-performance polymer composites for advanced electronic packaging materials.
Related
- First-Principles Calculations of Structural, Electronic, Optical, Vibrational, Dielectric, and Elastic Properties of Tetragonal Mg2TiO4 and Mg2TiO4:Mn4+
- Processing of PVDF/Nb5+ and Sr2+-Doped PZT Composites for Applications in Advanced Dielectric Insulation: Effect of Ceramic Loading on Structure, Mechanical Properties, Electrical Properties, and Thermal Aging Behavior
- Improved interfacial-bonding strength and electronic structure properties of graphene-reinforced Al composites by Cu coating.
- Overcoming the Performance Cliff at High Loadings: Enhanced Mechanical, Dielectric, and Rheological Properties of PBT Composites Reinforced with Flat Glass Fibers
- Electronic screening as a design lever in La-doped BaTiO3: coupling between polarization, dielectric response, and optical anisotropy
BibTeX
@article{fatima2026nextgeneration,
title = {{Next-generation electronic packaging materials: thermal-dielectric properties and design strategies in PI and PTFE-based composites}},
author = {Winges Fatima and Kang Wang and Muhammad Tarique and Doaa Zamel and Rui Wang and Chuan Xie and Guangliang Gary Liu},
journal = {Advanced Composites and Hybrid Materials},
year = {2026},
month = may,
doi = {10.1007/s42114-026-01849-w},
url = {https://doi.org/10.1007/s42114-026-01849-w},
note = {CC BY},
}
RIS
TY - JOUR
TI - Next-generation electronic packaging materials: thermal-dielectric properties and design strategies in PI and PTFE-based composites
AU - Winges Fatima
AU - Kang Wang
AU - Muhammad Tarique
AU - Doaa Zamel
AU - Rui Wang
AU - Chuan Xie
AU - Guangliang Gary Liu
PY - 2026
DA - 2026/05/19
JO - Advanced Composites and Hybrid Materials
DO - 10.1007/s42114-026-01849-w
UR - https://doi.org/10.1007/s42114-026-01849-w
AB - The rapid advancement of high-frequency and high-power electronic technologies has created an urgent demand for materials that simultaneously exhibit high thermal conductivity, low dielectric constant and loss, and robust mechanical reliability. Polyimide (PI) and polytetrafluoroethylene (PTFE) are among the most promising polymer matrices for advanced electronic packaging owing to their outstanding thermal stability, chemical resistance, and electrical insulation properties. Nevertheless, the relatively high dielectric constant of PI and the poor interfacial adhesion of PTFE and their intrinsically low thermal conductivity significantly limit their direct application in next-generation electronic substrates. This review systematically summarizes recent progress in PI and PTFE-based composite systems, with a particular focus on design strategies, fabrication routes, and structure property relationships governing their multifunctional performance. Various processing techniques are critically evaluated with respect to interfacial engineering, dispersion of fillers, and construction of networks. Emphasis is placed on ceramic, carbon, metal oxide and metallic fillers that enable the formation of efficient thermally conductive yet electrically insulating pathways within PI and PTFE matrices. Furthermore, the roles of surface functionalization, coupling agents, and hierarchical or double-percolation architectures in enhancing phonon transport, suppressing dielectric loss, and improving mechanical integrity are discussed in detail. Finally, current challenges and future perspectives are outlined, including interface optimization, filler alignment control, low-loss dielectric tailoring, and scalable manufacturing strategies for high-frequency applications such as 5G and microwave electronics. This review provides a comprehensive understanding of processing-structure-property correlations in PI-based and PTFE-based composites and offers guidance for the rational design of high-performance polymer composites for advanced electronic packaging materials.
SN - 2522-0128
SN - 2522-0136
ER -