Recent Advances in Performance-Driven Multiscale Strategies for Epoxy-Based Underfill Materials for Advanced Packaging
- 1Key Laboratory of Functional Materials and Applications of Fujian Province, School of Materials Science and Engineering, Xiamen University of Technology, Xiamen 361024, China
Abstract
The rapid evolution of advanced packaging toward high-density, high-power, and three-dimensional heterogeneous integration has placed increasingly stringent demands on package reliability, particularly because of the thermal expansion mismatch and associated thermomechanical stresses between silicon dies and substrates. Owing to their favorable combination of properties and highly tunable formulation chemistry, epoxy resins remain the predominant matrix materials for underfill applications. However, the design paradigm of epoxy-based underfills is shifting from the optimization of individual thermomechanical properties toward the coordinated regulation of thermal, rheological, mechanical, and reliability-related characteristics. This review summarizes recent advances in epoxy-based underfill materials from the perspectives of thermal management, rheological optimization, mechanical reinforcement, and reliability enhancement, with particular emphasis on the roles of filler engineering, resin and interfacial design, and curing-system regulation. The intrinsic coupling and trade-offs among different performance parameters are also discussed. Furthermore, emerging directions for underfill materials in advanced packaging are outlined, including multiscale structure–property relationships, reliability prediction, and intelligent formulation design. This review aims to provide insights into the synergistic design and practical implementation of high-performance epoxy-based underfill materials for next-generation electronic packaging.
Related
- Next-generation electronic packaging materials: thermal-dielectric properties and design strategies in PI and PTFE-based composites
- Valorization of Agro-Industrial By-Products in the Development of Bio-Polymer Films, Biodegradable Plasticulture, and Intelligent Food-Packaging Materials
- Bioplastics Beyond Materials: A Review on Regulatory, Economic, and Circular Pathways Toward Sustainable Food Packaging
- Suberin-Cutin inspired copolyester films as bio-based packaging materials
- Bio-Based Smart Packaging Materials for Next-Generation Food Systems
BibTeX
@article{wang2026recent,
title = {{Recent Advances in Performance-Driven Multiscale Strategies for Epoxy-Based Underfill Materials for Advanced Packaging}},
author = {Yi Wang and Yage Wang and Yihang Wu and Yujie Yan and Yuechan Li and Dongya Sun and An Xie},
journal = {Polymers},
year = {2026},
month = oct,
doi = {10.3390/polym18202481},
url = {https://www.mdpi.com/2073-4360/18/20/2481},
note = {CC BY 4.0},
}
RIS
TY - JOUR
TI - Recent Advances in Performance-Driven Multiscale Strategies for Epoxy-Based Underfill Materials for Advanced Packaging
AU - Yi Wang
AU - Yage Wang
AU - Yihang Wu
AU - Yujie Yan
AU - Yuechan Li
AU - Dongya Sun
AU - An Xie
PY - 2026
DA - 2026/10/11
JO - Polymers
DO - 10.3390/polym18202481
UR - https://www.mdpi.com/2073-4360/18/20/2481
AB - The rapid evolution of advanced packaging toward high-density, high-power, and three-dimensional heterogeneous integration has placed increasingly stringent demands on package reliability, particularly because of the thermal expansion mismatch and associated thermomechanical stresses between silicon dies and substrates. Owing to their favorable combination of properties and highly tunable formulation chemistry, epoxy resins remain the predominant matrix materials for underfill applications. However, the design paradigm of epoxy-based underfills is shifting from the optimization of individual thermomechanical properties toward the coordinated regulation of thermal, rheological, mechanical, and reliability-related characteristics. This review summarizes recent advances in epoxy-based underfill materials from the perspectives of thermal management, rheological optimization, mechanical reinforcement, and reliability enhancement, with particular emphasis on the roles of filler engineering, resin and interfacial design, and curing-system regulation. The intrinsic coupling and trade-offs among different performance parameters are also discussed. Furthermore, emerging directions for underfill materials in advanced packaging are outlined, including multiscale structure–property relationships, reliability prediction, and intelligent formulation design. This review aims to provide insights into the synergistic design and practical implementation of high-performance epoxy-based underfill materials for next-generation electronic packaging.
SN - 2073-4360
ER -