Hybrid Laser–Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing
Abstract
We demonstrate a novel method for fabricating densely packed, high-aspect-ratio cavities (depth to diameter ratio > 1) in silicon wafers coated with diamond-like carbon (DLC). The process combines femtosecond laser irradiation with subsequent wet etch (potassium hydroxide-based) or plasma etch (chlorine- and oxygen-based). The femtosecond laser is used to pattern precise openings in the DLC layer, exposing the underlying silicon, which is then rapidly etched to form well-defined cavities. This combined laser ablation and etching approach enables high-throughput fabrication of densely packed micrometer cavities and offers scalability toward industrial production. The resulting hybrid DLC-coated silicon structure, featuring densely packed cavities, may exhibit antireflective properties in the far-infrared spectrum range.
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BibTeX
@article{sedao2026hybrid,
title = {{Hybrid Laser–Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing}},
author = {Xxx Sedao and Javier Prada-Rodrigo and Agathe Cavanna and Ionut-Alexandru Bunea and Antoine Gonon and William Ravisy and Yannick Bleu and Christian Seassal and Yves Jourlin and Laurent Dubost and Nicolas Crespo-Monteiro and Razvan Stoian and Yoan Di Maio and Claire Deeb and Isabelle Verrier and Emilie Gamet},
journal = {Nanomaterials},
year = {2026},
month = sep,
doi = {10.3390/nano16181131},
url = {https://hal.science/hal-05745514v1},
note = {CC BY 4.0},
}
RIS
TY - JOUR
TI - Hybrid Laser–Etching Fabrication of High-Density Antireflective Microstructures on DLC-Coated Silicon Using Burst-Mode Bessel Beam Processing
AU - Xxx Sedao
AU - Javier Prada-Rodrigo
AU - Agathe Cavanna
AU - Ionut-Alexandru Bunea
AU - Antoine Gonon
AU - William Ravisy
AU - Yannick Bleu
AU - Christian Seassal
AU - Yves Jourlin
AU - Laurent Dubost
AU - Nicolas Crespo-Monteiro
AU - Razvan Stoian
AU - Yoan Di Maio
AU - Claire Deeb
AU - Isabelle Verrier
AU - Emilie Gamet
PY - 2026
DA - 2026/09/10
JO - Nanomaterials
DO - 10.3390/nano16181131
UR - https://hal.science/hal-05745514v1
AB - We demonstrate a novel method for fabricating densely packed, high-aspect-ratio cavities (depth to diameter ratio > 1) in silicon wafers coated with diamond-like carbon (DLC). The process combines femtosecond laser irradiation with subsequent wet etch (potassium hydroxide-based) or plasma etch (chlorine- and oxygen-based). The femtosecond laser is used to pattern precise openings in the DLC layer, exposing the underlying silicon, which is then rapidly etched to form well-defined cavities. This combined laser ablation and etching approach enables high-throughput fabrication of densely packed micrometer cavities and offers scalability toward industrial production. The resulting hybrid DLC-coated silicon structure, featuring densely packed cavities, may exhibit antireflective properties in the far-infrared spectrum range.
SN - 2079-4991
SN - 2079-4991
ER -