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Peer-reviewedCC BY-NC-ND 4.0Nature Communications

Branched-type nanocluster-junction fluorofluidic-gels for interface-adaptive thermal conduction and mechanical resistance

4 affiliations
  1. 1Laboratory of Bio-inspired Materials and Interfacial Science, Technical Institute of Physics and Chemistry, Chinese Academy of Sciences, Beijing, P. R. China
  2. 2School of Future Technology, University of Chinese Academy of Sciences, Beijing, P. R. China
  3. 3Hangzhou Institute of Medicine, Chinese Academy of Sciences, Hangzhou, Zhejiang P. R. China
  4. 4State Key Laboratory of Bioinspired Interfacial Materials Science, Bioinspired Science Innovation Center, Hangzhou International Innovation Institute, Beihang University, Hangzhou, Zhejiang P. R. China

Abstract

With the miniaturization and high integration of microelectronic devices, efficient thermal management is increasingly critical. Conventional thermal interface materials often suffer from a certain degree of mismatch between their thermal conductivity and contact thermal resistance. Herein, we develop a thermal interface fluorofluidic-gel with a branched-type nanocluster-junction network. Benefiting from the interfacial infiltration enabled by the branched-junction fluoronetwork and the efficient thermal pathways constructed by thermal conductive nanocomposites, the fluorofluidic-gel exhibits a high thermal conductivity of 5.89 W·m⁻¹·K⁻¹ and a low contact thermal resistance of 0.15 cm²·K·W⁻¹. It also achieves reversible adhesion and mechanical resistance, with an adhesive strength of 189.3 kPa, adhesion energy of 220.3 J·m⁻² and impact resistance of 3.91 J·cm⁻¹. In addition, this gel maintains thermal stability from −80 °C to 300 °C and exhibits an electrical breakdown strength exceeding 24 kV/mm. We ‌anticipate‌ that adaptive thermal interface fluorofluidic-gel presents a promising solution for high-heat-flux electronic thermal management.

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BibTeX
@article{tang2026branchedtype,
  title = {{Branched-type nanocluster-junction fluorofluidic-gels for interface-adaptive thermal conduction and mechanical resistance}},
  author = {Weiming Tang and Hangsheng Zhou and Hanyu Wang and Xingyue Zhu and Lei Jiang and Ziguang Zhao and Shutao Wang},
  journal = {Nature Communications},
  year = {2026},
  month = sep,
  doi = {10.1038/s41467-026-78046-2},
  url = {https://doi.org/10.1038/s41467-026-78046-2},
  note = {CC BY-NC-ND 4.0},
}
RIS
TY  - JOUR
TI  - Branched-type nanocluster-junction fluorofluidic-gels for interface-adaptive thermal conduction and mechanical resistance
AU  - Weiming Tang
AU  - Hangsheng Zhou
AU  - Hanyu Wang
AU  - Xingyue Zhu
AU  - Lei Jiang
AU  - Ziguang Zhao
AU  - Shutao Wang
PY  - 2026
DA  - 2026/09/26
JO  - Nature Communications
DO  - 10.1038/s41467-026-78046-2
UR  - https://doi.org/10.1038/s41467-026-78046-2
AB  - With the miniaturization and high integration of microelectronic devices, efficient thermal management is increasingly critical. Conventional thermal interface materials often suffer from a certain degree of mismatch between their thermal conductivity and contact thermal resistance. Herein, we develop a thermal interface fluorofluidic-gel with a branched-type nanocluster-junction network. Benefiting from the interfacial infiltration enabled by the branched-junction fluoronetwork and the efficient thermal pathways constructed by thermal conductive nanocomposites, the fluorofluidic-gel exhibits a high thermal conductivity of 5.89 W·m⁻¹·K⁻¹ and a low contact thermal resistance of 0.15 cm²·K·W⁻¹. It also achieves reversible adhesion and mechanical resistance, with an adhesive strength of 189.3 kPa, adhesion energy of 220.3 J·m⁻² and impact resistance of 3.91 J·cm⁻¹. In addition, this gel maintains thermal stability from −80 °C to 300 °C and exhibits an electrical breakdown strength exceeding 24 kV/mm. We ‌anticipate‌ that adaptive thermal interface fluorofluidic-gel presents a promising solution for high-heat-flux electronic thermal management.
SN  - 2041-1723
ER  -