Wafer-scale robust graphene electronics under industrial processing conditions

Abstract

When commercial grade electronic devices contain nanomaterials like graphene, it is crucial that these materials resist industrial processes and harsh environments. For environments that contain water, graphene delamination due to intercalation is a notorious problem. This renders graphene incompatible with key wafer-processing steps in the semiconductor industry. In this work, a covalent pyrene-based adhesion layer is synthesized in a facile, two-step procedure. Through π–π interactions, the adhesion of graphene to silicon wafers was maintained under harsh processing conditions, i.e. acidic and alkaline solutions, several organic solvents, and sonication. Moreover, devices were produced with a measurement yield up to 99.7% and reproducible device-to-device electronic performance on 4-inch silicon wafers.

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Cite

BibTeX RIS

BibTeX

@article{geest2026waferscale,
  title = {{Wafer-scale robust graphene electronics under industrial processing conditions}},
  author = {E. van Geest and B. Can and M. Makurat and C. Maheu and H. Sezen and M. Barnes and D. Bijl and M. Buscema and S. Shankar and D. Wehenkel and R. van Rijn and J. Hofmann and J. van Ruitenbeek and G. Schneider},
  journal = {Chemical Communications},
  year = {2026},
  month = jul,
  doi = {10.1039/d6cc01037g},
  url = {https://hal.science/hal-05696333v3},
  note = {CC BY 4.0},
}

RIS

TY  - JOUR
TI  - Wafer-scale robust graphene electronics under industrial processing conditions
AU  - E. van Geest
AU  - B. Can
AU  - M. Makurat
AU  - C. Maheu
AU  - H. Sezen
AU  - M. Barnes
AU  - D. Bijl
AU  - M. Buscema
AU  - S. Shankar
AU  - D. Wehenkel
AU  - R. van Rijn
AU  - J. Hofmann
AU  - J. van Ruitenbeek
AU  - G. Schneider
PY  - 2026
DA  - 2026/07/03
JO  - Chemical Communications
DO  - 10.1039/d6cc01037g
UR  - https://hal.science/hal-05696333v3
AB  - When commercial grade electronic devices contain nanomaterials like graphene, it is crucial that these materials resist industrial processes and harsh environments. For environments that contain water, graphene delamination due to intercalation is a notorious problem. This renders graphene incompatible with key wafer-processing steps in the semiconductor industry. In this work, a covalent pyrene-based adhesion layer is synthesized in a facile, two-step procedure. Through π–π interactions, the adhesion of graphene to silicon wafers was maintained under harsh processing conditions, i.e. acidic and alkaline solutions, several organic solvents, and sonication. Moreover, devices were produced with a measurement yield up to 99.7% and reproducible device-to-device electronic performance on 4-inch silicon wafers.
SN  - 1359-7345
SN  - 1364-548X
ER  -

Abstract

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