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Peer-reviewedCC BY-NCRSC advances

Controllable assembly of low-dielectric polycarbonate/boron nitride nanosheet porous aerogel composite membranes with pore-wall thermal-conductive networks

  1. 1College of Life Sciences, Zhuhai College of Science and Technology Zhuhai 519041 China
  2. 2Goertek College of Science and Technology Industry, Weifang University Weifang Shandong 261061 China

Abstract

The rapid advancement of fifth-/sixth-generation (5G/6G) telecommunications and high-density packaging has intensified the power-density crisis, creating a critical trade-off between thermal management and ultra-low dielectric requirements for substrate materials. Herein, we propose a controllable assembly strategy integrating polycarbonate (PC)-assisted ball-milling exfoliation with non-solvent-induced phase separation (NIPS). PC chains non-covalently exfoliate hexagonal boron nitride (h-BN) into boron nitride nanosheets (BNNS; average lateral dimension ∼636 nm, thickness ∼2.0 nm, 3–7 layers) while simultaneously functionalizing the surface. A one-step volatile phase separation in a dichloromethane/isopropanol dual-solvent system constructs porous aerogel membranes featuring a dual-network architecture: an interpenetrating porous scaffold with pore-wall thermal-conductive networks. At 30 wt% BNNS loading, the composite membrane achieves in-plane and through-plane thermal conductivities of 0.30 and 0.25 W m−1 K−1, respectively, representing a threefold enhancement over pristine PC aerogel. Concurrently, the dielectric constant reaches 1.25 at 106 Hz with a loss tangent of 0.009, and the tensile stress of 12.55 MPa ensures mechanical integrity. By decoupling thermal transport through pore-wall BNNS percolation networks from dielectric response via air-phase dilution, this strategy enables concurrent high thermal conductivity, ultra-low permittivity, and robust mechanical performance in a lightweight thermoplastic platform.

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BibTeX
@article{xu2026controllable,
  title = {{Controllable assembly of low-dielectric polycarbonate/boron nitride nanosheet porous aerogel composite membranes with pore-wall thermal-conductive networks}},
  author = {Lanshu Xu and Haohan Chen and Zhiqing He and Yixiao Zhang and En Deng and Junming Peng and Chengming Wang and Yiqiang Huang and Xiue Ren and Linlin Cui},
  journal = {RSC advances},
  year = {2026},
  month = oct,
  doi = {10.1039/d6ra04564b},
  url = {https://europepmc.org/article/PMC/PMC13721904},
  note = {CC BY-NC},
}
RIS
TY  - JOUR
TI  - Controllable assembly of low-dielectric polycarbonate/boron nitride nanosheet porous aerogel composite membranes with pore-wall thermal-conductive networks
AU  - Lanshu Xu
AU  - Haohan Chen
AU  - Zhiqing He
AU  - Yixiao Zhang
AU  - En Deng
AU  - Junming Peng
AU  - Chengming Wang
AU  - Yiqiang Huang
AU  - Xiue Ren
AU  - Linlin Cui
PY  - 2026
DA  - 2026/10/30
JO  - RSC advances
DO  - 10.1039/d6ra04564b
UR  - https://europepmc.org/article/PMC/PMC13721904
AB  - The rapid advancement of fifth-/sixth-generation (5G/6G) telecommunications and high-density packaging has intensified the power-density crisis, creating a critical trade-off between thermal management and ultra-low dielectric requirements for substrate materials. Herein, we propose a controllable assembly strategy integrating polycarbonate (PC)-assisted ball-milling exfoliation with non-solvent-induced phase separation (NIPS). PC chains non-covalently exfoliate hexagonal boron nitride (h-BN) into boron nitride nanosheets (BNNS; average lateral dimension ∼636 nm, thickness ∼2.0 nm, 3–7 layers) while simultaneously functionalizing the surface. A one-step volatile phase separation in a dichloromethane/isopropanol dual-solvent system constructs porous aerogel membranes featuring a dual-network architecture: an interpenetrating porous scaffold with pore-wall thermal-conductive networks. At 30 wt% BNNS loading, the composite membrane achieves in-plane and through-plane thermal conductivities of 0.30 and 0.25 W m−1 K−1, respectively, representing a threefold enhancement over pristine PC aerogel. Concurrently, the dielectric constant reaches 1.25 at 106 Hz with a loss tangent of 0.009, and the tensile stress of 12.55 MPa ensures mechanical integrity. By decoupling thermal transport through pore-wall BNNS percolation networks from dielectric response via air-phase dilution, this strategy enables concurrent high thermal conductivity, ultra-low permittivity, and robust mechanical performance in a lightweight thermoplastic platform.
SN  - 2046-2069
ER  -